Latest Posts
Package Designers Need Assembly-level LVS Signoff for HDAP Verification
While advanced IC packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique package connectivity... Implementing High-Density Advanced Packaging for OSATs and Foundries
Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in...
Getting IC Package Design Right the First Time
Once considered to be one of the simpler tasks in semiconductor device manufacturing, IC package design has become more complicated... Solving the Design and Verification Challenges of High Density Advanced Packaging
Today’s electronic products present new challenges to product development teams. As a result, there is a constant push to improve...
Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP
For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly...
New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging
Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
