Implementing High-Density Advanced Packaging for OSATs and Foundries

Moore’s law is increasingly difficult to maintain and is driving the growth of innovative high-density advanced packaging (HDAP) technologies in response to system scaling demands. These innovations are increasingly in the form of fan-out wafer level packaging (FOWLP) or multi-substrate / multi-device packages like interposers and system-in-package (SiP).

New challenges come with these disruptive technologies as they employ silicon-like features and processes or multi-substrate architectures to facilitate high-performance memory devices like HBM/HMC.

Today’s package design methodologies and tools are at an inflection point as significant as the transition from MCAD tools for lead frames to ECAD tools for PBGAs. The entry of silicon foundries into the packaging supply chain further disrupts tools and methodologies with their application of silicon PDKs (Process Design Kits) and verification processes to packaging.

The requirements and challenges of HDAP design and verification demand new EDA tools, functionalities, and flows. HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. With common tools that have the integration and functionality needed to operate in both the IC and packaging domains, companies can reduce turnaround time and the risk of package failure. Mentor’s Xpedition HDAP flow ensures that package designers, foundries, and OSATs have all the design and verification capabilities needed to take advantage of this exciting HDAP packaging technology and the markets it serves.