Latest Posts - Page 6
The HBM Supply Chain is Open for Business!
Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the...
Will the Internet of Everything Really Make the World a Better Place?
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
Having the Courage to Design in 3D TSVs
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...Amkor Technology Licenses Proprietary Through Mold Via Technology to SHINKO
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units
Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...What the packaging foundries had to say….
Friday was the OSATs turn to offer their status reports with regard to market readiness for 3D TSV production.
