Last June, AMD made 3D integration history with its introduction of the Fiji gaming processor unit (GPU), which for the...
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
I don’t know why it still surprises me to read conflicting reports on the progress of 3D TSVs. But I...
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license...
Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...
Friday was the OSATs turn to offer their status reports with regard to market readiness for 3D TSV production.
After attending Curtis Zwenger’s presentation introducing Amkor’s latest contribution to the package-on-package (PoP) family based on the company’s proprietary
