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March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range...
SurplusGLOBAL Cluster is a new Semiconductor Equipment Cluster in Yong-In, South Korea, offering access to the largest complex of used semiconductor equipment. Near 30 companies related to the semiconductor equipment industry are currently scheduled to move in to cluster. Plans are to complete the construction of the floor space 68,317...
From the cloud to edge computing, the quest for ever-greater power efficiency remains researchers’ top priority. From high-end niche to mass-market applications, the best cost-to-performance tradeoff is key to providing a competitive advantage. While Moore’s Law has helped meet the performance required in terms of data transfer and power efficiency...
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost 54 billion packages. Smartphones, wearables, and consumer packages account for the largest number. RF front-end modules including the latest 5G mmWave modules and wireless connectivity modules for Wi-Fi, Bluetooth, and...
TEMPE, Ariz., February 23, 2021 ― Amkor Technology, Inc. (Nasdaq: AMKR), a leader in advanced packaging technologies that support high-growth markets, including smartphones and 5G, advanced automotive systems, high-performance computing and consumer IoT, recently unveiled new measures that help the company achieve Industry 4.0 initiatives, extending its leadership in quality...
EVG Academy doubles the amount of training space and technical trainers; provides training on every class of EVG equipment and software EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced that it has established the EVG Academy, a...
Wilmington, Mass., December 16, 2020 – Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of its new product, the Aspect® IRCD System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices. After successful factory demonstrations, additional Aspect systems are shipping this quarter...
PLAINVIEW, N.Y., Nov. 30, 2020 — Veeco Instruments Inc. (NASDAQ: VECO) today announced that Transphorm, Inc. (OTCQB:TGAN), a global supplier of gallium nitride (GaN) products for high voltage power conversion applications, has selected Veeco’s Propel™ HVM MOCVD System for high-volume production of GaN-based RF (DoD and Commercial/5G) and power electronics...
Veeco’s Best-in-Class Precision Surface Processing Platform Supports SkyWater’s Collaborative Work with Massachusetts Institute of Technology to Maximize Electronic Device Performance PLAINVIEW, N.Y. and BLOOMINGTON, MN, — Veeco Instruments Inc. (NASDAQ: VECO) today announced that SkyWater Technology Foundry has taken delivery of the WaferStorm® single wafer wet process system to support advanced...
Veeco’s WaferStorm® Platform and AP300™ Lithography System Deliver Premier Process Performance, Platform Flexibility and Low Cost of Ownership PLAINVIEW, New York, — Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer solvent wet process tool and its AP300™ lithography...
