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SEMI Showcases New Conductor™ Intelligence Platform for Enhanced Global Supply Chain Collaboration

Co-developed with SEMI Supply Chain Management Initiative companies and partners to improve visibility and accelerate decision making across industries SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced its new Conductor™ intelligence platform for enhanced supply chain management at SEMICON Taiwan. The platform was developed as...

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, and High-Performance Computing

Presentations at SEMICON Taiwan 2025 demonstrate how materials impact sustainability, artificial intelligence, and high-performance computing Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, will share its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science will present the...

IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor

Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...

INTEL CHIPS ACT

IFTLE 606: Is Intel CHIPS Act Money Being Delayed?

Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming Wary of Intel Investment? Toms Hardware, a great site for the latest info on microelectronic hardware, is noting that Intel is reportedly facing a delay in the release of its...

Closing Out 2020 at the MEPTEC Holiday Hangout

After nine months of Zooming into all the virtual events, I can’t wait for things to go live again. In the meantime, I took the opportunity last week to pop into the MEPTEC Holiday Hangout. As my last blog post of 2020, I thought I’d share some tidbits of the...

EV Group Completes Construction of State-of-the-Art Cleanroom Facility at Corporate Headquarters

Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction of its new Cleanroom...

Virtual DAC 2020 Addresses Chiplets and Advanced Packaging

Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National Semiconductor and VLSI Technology – could not keep up with market requirements. Lack of competitive electronic design automation (EDA) tools limited their engineers’ productivity and eventually both of these –...

Seen on the Scene at Electronica 2018

This was my first Electronica, and all I can say is – It is massive. It covered everything to do with the electronics supply chain, from chip design to the chip itself, to the package, component, subassembly, circuit board, through to test and measurement, and enclosures, switches, the works. While...

3D InCites: The First Decade

Don’t miss your chance to receive your copy of 3D InCites: the First Decade Take a look inside our 10th-anniversary commemorative issue.: On the Cover: 10 Years of Invent, Innovate, Implement Françoise von Trapp returns to EV Group headquarters for her fourth visit and reminisces about the past 10 years....