Matches for your search: "SEMICON West"
November was a dynamic month for the 3D InCites community and the broader semiconductor industry, with companies showcasing innovative technologies, celebrating leadership achievements, expanding global operations, and advancing workforce development. From product launches and AI‑enhanced design platforms to award recognitions and strategic partnerships, industry leaders highlighted breakthroughs in advanced packaging, inspection,...
Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, will exhibit its latest advancements in sustainable lithography processes at SEMICON Europa 2025. Attendees are invited to visit Brewer...
New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the...
August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...
In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused on software for FPGA design and were a clear leader in this rapidly growing field. For about three years I really enjoyed contributing to their success, primarily for three reasons: ...
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the...
Key advanced packaging technology influencers came out in force to discuss the status of EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business (Mentor) and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor,...
2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry. An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed. As a result, in 2016, we are working within a significantly reshaped...
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
