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Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG sees continued strong growth in region EV Group (EVG) today announced that it will highlight key advances in 3D integration process solutions, including hybrid and fusion wafer bonding, infrared (IR)...
Presentation abstracts are now being accepted for the Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share...
SHANGHAI ─ February 27, 2024 ─ With China leading the global semiconductor industry in the production capacity expansion, SEMICON China 2024 is gearing up to host industry visionaries and leaders March 20-22 at the Shanghai New International Expo Centre for insights into the latest developments, trends and innovations in areas critical to industry...
It is my pleasure to inform you that SEMICON Taiwan Hybrid will open next week from Sep. 23 (Wed.) – 25 (Fri), which will be the first SEMICON that offers both in-show and virtual experiences at the same time. Even though we cannot meet in person this time due to...
Co-located with productronica in Munich, Germany, SEMICON Europa attracts and connects industry-leading technology companies from every segment of the European microelectronics industry. Held November 12-15, this year’s events will expand attendee opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing platform in Europe,...
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed...
There’s nothing quite as exciting as watching a major sporting event when rival teams meet head-to-head. Even if you don’t have a vested interest in either team, you still get caught up in the excitement of the game itself. That’s sort of how I feel when I get back-to-back...
So there I was, listening to Eric Beyne talk about the importance of co-developing advanced CMOS and 3D ICs because one directly affects the other, when my thoughts turned to once again to FinFets (is this what he means by advanced CMOS?) I wondered whether these so-called 3D transistor structures...
You know how sometimes you feel like you know a person you haven’t actually met because you read something they wrote or sat through a presentation? And then when you finally meet face to face, it’s like meeting an old friend, “Oh you’re so-and-so!! I feel like I already KNOW...
For me, SEMICON West is never complete until I’ve had my sit-down with Manish Ranjan of Ultratech. He follows the market, and somehow puts it all into perspective for me, often supporting my own intuition with hard data. Plus he’s a wealth of historical...
