From Different Dimensions

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Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.

Community Member Monthly Highlights — May

SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence...

Building a Chiplet Ecosystem

The semiconductor industry’s decades-long adherence to Moore’s Law doctrine of doubling transistor counts on monolithic devices every 18 – 24 months has been amazingly successful. It’s now possible to integrate tens of billions of transistors onto a monolithic die whose area may be hundreds of square millimeters. The resulting chips...

Community Member Monthly Highlights – April 2023

Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent for 3D-IC Design. Cadence collaborates with universities on system packaging education and talent development through the Cadence Academic Network program, which provides students with access to Cadence advanced IC packaging...

Has Our Industry Become More Sustainable?

The quick answer to the question; “Is the semiconductor industry becoming more sustainable?” is “yes and no.” There is undoubtedly more talk about sustainability and environmental impact, especially from the larger companies in our industry. In 2022, SEMICON West devoted an entire day to the topic for the first time....

The Importance of Smart Data Solutions

Today, semiconductor manufacturers face more challenges with their data as semiconductors increase in complexity. More sophisticated testing equipment and sensors at every step of the process contribute heavily to the avalanche of data being collected. At the same time, manufacturers are under pressure to increase yields and cut costs. To...

water conservation

Sustainability 101: Water Conservation and Innovation

March 22 was World Water Day, a perfect excuse to reflect on water use in semiconductor manufacturing. What industry leaders are doing about water conservation All the nominees for the 3D InCites 2023 Sustainability Award are tackling water conservation and recycling. Henkel reduced water use per ton of product by...

Net Zero

Lam Research’s Net Zero Journey Gains Momentum

At Lam, we view environmental, social, and governance programs (ESG) as a business imperative. We focus on improving our communities and the environment and strive to incorporate supportive actions into everything we do – from our operations and workplace practices to how we source our materials and design our products....

IMAPS DPC Community Member Preview

The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference Center, with an anticipated record number in attendance. The microelectronics assembly & advanced packaging event will bring together industry engineers, researchers and top experts participating in a multi-faceted technical program...

Highlights of SEMI ISS Europe 2023

SEMI Europe’s Industry strategy Symposium (ISS 2023) took place as an in-person-only event on February 15-16, 2023, at Hilton Vienna Park Hotel, Vienna, Austria. For me, this was the best ISS Europe ever. That’s not only because it is the first ISS Europe that I attended, but also because this...