Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 22
European 3D TSV Summit: 3D TSVs Come of Age
Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European...
Inside the Gadgets at CES 2013
One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show,...
More Tech Notes from 3D ASIP 2012
Oh yes, where was I before the holidays took over and hijacked my life for two weeks? I’ll bet you...
Fraunhofer IZM Update with M. Juergen Wolf
I’ve been on a mission to interview the directors of all three European microelectronics research centers that are participating in...
3D ASIP 2012: Damn the Torpedos! Full Speed Ahead!
After attending last week’s 9th Annual Architectures for Semiconductor Integration and Packaging Conference in Redwood City, CA, it’s pretty clear...3D IC Pioneers Continue to Lead the Way
For me, the most exciting news so far at this year’s 3D ASIP conference has been the announcement that Tezzaron...Check this out: easier debonding?
It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being...Tour de France in 3D – Day 2
Another early start (5:30am) to catch the train to Grenoble. The trains went on strike (a regularly scheduled occurrence) but...Tour de France in 3D – Day One
Arrived in Paris, 6:55am. Checked in to L’hotel Petit Madeline 8:00am.Tour de France in 3D – Day 3
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...
Tour de France in 3D – Day 4
Our visit to the St. Jeoire facility of Replisaurus/SET got off to a...