Processes and Technology

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in EETimes, “silicon validation of these flows signifies the opening up of the manufacturing processes for the desig... »

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

3D IC Commercialization: Glimmers of Progress and Push for Collaboration and Choices to Make

Recent signs that we’re getting closer to commercialization of 3D ICs? For one, analog and sensor IC company, ams AG, threw down the gauntlet, announcing it is investing more than €25M ($33M) to add manufacturing capacity for 3D ICs in its fab located near Graz, Austria. Analog 3D ICs featuring through silicon vias (TSVs) are already a reality at ams. The company introduced its first 3D IC int... »

ASML at Semicon West 2013: SRAM Scaling has Stopped!

ASML at Semicon West 2013: SRAM Scaling has Stopped!

We have a guest contribution from Zvi Or-Bach, the President and CEO of MonolithIC 3D Inc. Zvi adds information to his previous blog post: Dimension Scaling and the SRAM Bit-Cell. I just downloaded the ASML presentation from Semicon West2013 site – ASML’s NXE Platform Performance and Volume Introduction. Slide #5 – IC manufacture’s road maps – says it all. Embedded SRAM will ... »

Atoms Don’t Scale: What is Beyond 7nm (2019)?

Atoms Don’t Scale: What is Beyond 7nm (2019)?

We have a guest contribution today from Brian Cronquist, MonolithIC 3D Inc.’s VP of Technology & IP. Brian discusses about MonolithIC 3D Inc.’s participation at Semicon West 2013. Thanks to everybody who came by the Silicon Innovation Forum poster session at SEMICON West 2013. We really enjoyed talking with you about all the exciting possibilities for new products and processes th... »

Figure 1: Electrografting provides a very strong adhesion between organics and any surface

Alchimer Streamlines Wet Approach

Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in the company’s early days, and again si... »

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