SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication. SABRE 3D offers industry-leading throughput along with reduced cost of consumables to enable high economic value for customers.
Electroplating is one of the most challenging process steps for TSV fabrication. Lam’s SABRE 3D enables the fastest and most consistent TSV fill rate on a production-proven hardware platform to ensure void-free fill at lowest cost of ownership. Specific innovations to reduce cost of TSV manufacturing are listed below:
- Fast fill rate (25% higher) and wide process window for various features and geometries
- Proprietary advanced pretreatment technology enables uniform wetting to ensure high yield
- Superior fill quality with void-free fill across range of different aspect ratios
- Excellent process stability with advanced hardware and plating bath control, including an advanced dosing algorithm that ensures a stable process over extended wafer runs
- Modular design along with stacked architecture enables maximum footprint efficiency in the wafer fab
- Industry-leading productivity with up to 50% lower cost of ownership compared with competitive offerings.