Latest Posts
Congratulations to the Winners of the 2022 3D InCites Awards!
It is my honor to announce the winners of the 2022 3D InCites Awards. With 51 nominees in 11 categories,...
Everything You Need to Know About Nominating Your Company for the 2022 3D InCites Awards
Get ready! The 2022 3D InCites Awards nominations are open! This year, we are excited to partner with the International...
Help Us Meet our 100K Goal for the 3D InCites DEI Fund
Last year, we put our money where our mouth is. Instead of just talking about how diversity, equity, and inclusion...
Drum Roll Please! The Winners of the 2021 3D InCites Awards are…
Like every other awards event in the past year, the 2021 3D InCites Awards Program had to make some adjustments...
And the Winners of the 2020 3D InCites Awards Are…
The 2020 3D InCites Awards program has been a bit of a nail biter for us all, as we waited...
A Race to the Finish: Announcing the Winners of the 2019 3D InCites Awards
The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable...
Congratulations to the Winners of the 2015 3D InCites Awards
For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D...
Lam Research: SABRE 3D
SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary... Nordson ASYMTEK: Programmable Tilt + Rotate 5-Axis Fluid Dispenser
Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y...
Mentor Graphics: Xpedition Package Integrator
Xpedition® Package Integrator provides a holistic co-design methodology that automates planning and optimization of connectivity from a chip through multiple... Dow Corning: Thermally Conductive Gel TC-3040
TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation. The material features a combination of low modulus and... SPTS: Sigma fxP PVD with Multi-Wafer Degas
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It... Broadpak: 2.5D/3D Package Security IP
Industry’s first 2.5D/3D security IP from BroadPak provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents... Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry
SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable... KLA-Tencor: CIRCL-AP™
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced... Indium Corporation: Wafer Flux WS-3543
Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers... Amkor: SLIM
Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level...
Xilinx: Ultrascale VU440 3D FPGA
The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It... 