The 2019 3D InCites Awards vote was a nail-biter right up until the end. While some categories seemed almost predictable from start, others were neck-and-neck, with the front runner changing on a daily basis. What was most exciting to me, however, was how many new participants we had, and how well they did. So, from almost-to-close-call to we-never-saw-that-one-coming, here’s my analysis of th... »
Through-silicon vias (TSVs) have been firmly established as a method of interconnect that enables high bandwidth and low latency between dies at extremely low power dissipation. Used for years in microelectromechanical systems (MEMS), compound semiconductors, and image sensors, TSVs are now also in mainstream production for 2.5D interposer technologies, and for stacking die to create high-bandwidt... »
We are pleased to announce the winners of the 2018 3D InCites Awards, sponsored by KLA-Tencor and EV Group and hosted by iMAPS. This may have been the most exciting awards year yet, with 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. The competition was fierce! We logged in over 40,619 online votes, more than twice the number of last years event. T... »
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of heterogeneous integration tech... »
Move to 300mm Strengthens Customer’s Position in the Rapidly Growing CMOS Image Sensor Market Newport, United Kingdom, 29 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that a leading Chinese wafer level packaging (WLP) supplier to the electronics industry has selected the Omega fxP Etc... »
Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that it has partnered with SEMI and TechSearch International to host the second annual 3D InCites Awards. Proceeds of the 2014 awards program will fund a newly formed 3D InCites STEM Scholarships program, which this ... »
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched 3D InCites at SEMICON West 2009. I felt truly honored to be surrounded by such industry elit... »
The public opinion poll closed for the first annual 3D InCites Awards on Wednesday July 3, with over 1350 votes cast for 25 nominees in 5 categories. While this poll only represents one vote in the final tally for the awards, I think it’s worth acknowledging the poll winners themselves. In the 3D Products (Design/Products) category, Xilinx is leading the pack with 78 votes for its Virtex-7 H580T... »
Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch International, is fast approaching, and we’ve got an exciting program shaping up. We’re hap... »
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