SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping.
In the latest 2.5D and 3D packaging schemes utilizing copper µpillars, SnAg caps with diameters down to ~10µm are electroplated on top of the µpillars. SOLDERON BP TS 6000 Tin-Silver is capable of WID and WIW of <5%, which represents best-in-class solder chemistry performance. A critical characteristic of solder bumping is bump morphology and composition control, which is relatively easy to manage in larger traditional C4 bump applications. However, as the bump shrinks, the morphology tends to become rough and silver compositions become higher and non-uniform. SOLDERON BP TS 6000 Tin-Silver overcomes this challenge because its additive system was specifically developed to address this issue such that tight distribution of silver compositions and smooth morphology are maintained down to fine feature SnAg plating. As a result, the chemistry helps improve assembly yield and long-term reliability of 2.5D and 3D IC devices.
Dow Electronic Materials Website
Date this Product was Introduced to the market: October 2013
Category Product is Being Nominated for: Materials
Technical Documentation for Solderon BP TS 6000 Tin-Silver Chemistry