3D In Context

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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

IC Packaging: An Essential Enabler and Differentiator, Part 2

The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11, continued from Part 1.  Wednesday morning started with a IC packaging session focused on my favorite subject: Multi-die Integration. Trevor Yancey, who recently joined Jan Vardaman at TechSearch International, talked about the IoT and gave an example for how the...

IC Packaging: An Essential Enabler and Differentiator, Part 1

The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major benefits with every feature size reduction, the economics of transistor scaling are now no longer universally applicable. Only designs that can be sold in extremely high volumes are likely to...

Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All

Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This panel was no different. Francoise moderated the IWLPC 2015 Panel Discussion: Interposers, 3D TSVs, and Alternatives: What are the Options and Where do They Fit? featuring Aric Shorey, Corning, Inc.; Thibeault Buisson, Yole...

TSMC’s Grand Alliance: A Powerful EcoSystem

On Thursday, September 17, I was invited to attend TSMC’s Open Innovation Platform (OIP) conference, that showed TSMC’s rapid progress and the power of TSMC’s Grand Alliance. As a former Alliance Manager, I really enjoyed seeing how TSMC’s far-reaching vision and strategic alliances, combined with excellent execution and customer service,...

Ideas for Co-optimizing Chip-Package Design

In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...