A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring heterogeneous ntegration to the masses.


READY – AIM – FIRE! Predictions for 2.5D ICs in 2014

Major SoC vendors, like Intel and IBM, started development work on 3D ICs more than a decade ago, but so far, economics have discouraged them from starting volume production. Ho-Ming Tong, CTO, ASE, and his team realized a few years ago that vertical stacking of logic die and/or heterogeneous functions did (and still do) require major engineering efforts and significant business model changes befo... »

smartphoneusage IWLPCPanel2013

Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013

The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I had an opportunity to attend part of the technical sessions and the keynote Invensas’ president, Simon Mc Elrea, presented on Thursday morning. I also enjoyed the 3D Panel, moderated by Sitaram Arkalgud, formerly at SEMATECH, now at Invensas, on Thursday afternoon. If yo... »

V-NAND-SSD_03-0 VAND copy

Comparing Samsung’s 3D NAND with Traditional 3D ICs

At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility is to manage Samsung’s System Architecture Labs, he talked ... »

Page 9 of 9«789