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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

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Comparing Samsung’s 3D NAND with Traditional 3D ICs

At last week’s Memcon 2013, which took place Tuesday, August 6, 2013, at the Santa Clara Convention Center, Keynoter Bob Brennen, Senior VP at Samsung, talked about the need for New DRAM and Flash Memory architectures. Richard Goering summarized Brennan’s keynote very well in his blog post. Because Brennan’s responsibility is to manage Samsung’s System Architecture Labs, he talked ... »

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