Are you ready for an exciting week at SEMICON Taiwan 2025? From September 8-12, more than 1,100 semiconductor companies from around the world will gather at the Taipei Nangang Exhibition Center to network, share insights, and plan for the future. As the industry gets closer to reaching its $1 trillion global revenue milestone, SEMICON Taiwan will offer a dedicated forum for collaboration and innovation.
Unsurprisingly, our 3D InCites member community is taking full advantage of this incredible opportunity. This year, we have 15 member companies presenting and 25 exhibiting. In addition, ASE and TechSearch International will be giving keynote presentations that you won’t want to miss.
- Learn more about Taiwan’s strategic role in the semiconductor industry from ASE’s Tien Wu on Sept. 10 from 3:55-4:35 p.m.
- Dive into today’s AI packaging market drivers and trends with TechSearch’s Jan Vardaman on Sept. 12 from 9 – 9:25 a.m.
If you’ll be at SEMICON Taiwan, be sure to stop by our member presentations and booths. Although Francoise and I will not be in attendance, we look forward to keeping up with you all on LinkedIn.
Member Presentations
ASE
Silicon Photonics Global Summit
- CPO: Fusion Interconnect of Electric and Photonics from Advanced Packaging Perspective
- Monday, September 8 from 3:25-3:50 p.m.
- Vincent Lin
3DIC Global Summit
- Keynote: Panel Discussion – Topic TBD
- Tuesday, September 9 from 10:50 a.m. – 12 p.m.
- Mike Hung
CEO Summit (Keynote)
- Fireside Chat - Navigating What’s Next: Global Opportunities and Taiwan’s Strategic Role
- Wednesday, September 10 from 3:55-4:35 p.m.
- Tien Wu
Brewer Science
IC Forum-Advanced Chip Technology and Manufacturing
- A No Bake Lithography Process
- Tuesday, September 9 from 3:50 – 4:10 p.m.
- Douglas Guerrero
Heterogeneous Integration Global Summit – Day 1
- From Lab to Line: Accelerating AI Packaging Innovation Through Ecosystem Coordination
- Tuesday, September 9 from 4:05 – 4:30 p.m.
- Poupak Khodabandeh
Camtek
Heterogeneous Integration Global Summit 2025 – Day 2
- Metrology Solutions in Advanced Packaging for 2025 and Beyond
- Thursday, September 11 from 11:10-11:30 a.m.
- Alejandro Avellan
Comet Xylon
Heterogeneous Integration Global Summit 2025 – Day 2
- AI Meets X-ray: The New Standard in Non-Destructive Chip-on-Wafer Inspection
- Thursday, September 11 from 10:10-10:30 a.m.
- Isabella Drolz
Advanced Testing Forum
- AI-Enhanced X-ray Metrology: Redefining Non-Destructive Inspection for Chip-on-Wafer Integration
- Thursday, September 11 from 11:45 a.m. – 12:10 p.m.
- Dionys van de Ven
Edwards
Semiconductor Sustainability Summit
- Reducing Scope 2 Emissions in Semiconductor Manufacturing Through Vacuum System Innovation
- Wednesday, September 10 from 1:40-2:05 p.m.
- Neil Garland
EV Group
Heterogeneous Integration Global Summit 2025 – Day 3
- Fusion and Hybrid Wafer Bonding: The Past, The Present, and the Future
- Friday, September 12 from 2:10-2:30 p.m.
- Anton Alexeev
Henkel
Heterogeneous Integration Global Summit 2025 – Day 2
- Novel Materials Addressing Thermal Management Challenges in Heterogeneously Integrated Packages for Datacenter & Mobile Applications
- Thursday, September 11 from 2:45-3:05 p.m.
- Raj Peddi
IBM
Partner Program: Quantum Taiwan Forum
- Future of Computing – The Foundation of Computing Technology in the AI Era
- Thursday, September 11 from 9-9:30 a.m.
- Norishige Morimoto
Kulicke and Soffa
Smart Manufacturing Forum
- Smart Manufacturing Action is now – AI-Enabled OEE Improvements for Semiconductor Backend
- Thursday, September 11 from 11:30-11:55 a.m.
- Chan Pin Chong
Heterogeneous Integration Global Summit 2025 – Day 3
- Challenges to Fluxless TCB
- Friday, September 12 from 11:45 a.m. – 12:05 p.m.
Nordson Test & Inspection
Heterogeneous Integration Global Summit 2025 – Day 2
- Inspection & Metrology Technologies for Mid-End and Back-End Semiconductor that Improve Yields, Processes and Productivity
- Thursday, September 11 from 3:45-4:05 p.m.
- Vidya Vijay
Nova
Heterogeneous Integration Global Summit – Day 1
- Advanced Optical Metrology Solutions for AI Packaging Processes
- Tuesday, September 9 from 4:30 – 4:55 p.m.
- Roy Shtainman
PDF Solutions
Smart Manufacturing Forum
- The Evolution of AI Applications for Process Control
- Thursday, September 11 from 3:50-4:15 p.m.
- Jon Holt
Heterogeneous Integration Global Summit 2025 – Day 3
- AI for Manufacturing and Test, the New Frontier
- Friday, September 12 from 2:50-3:10 p.m.
- Ming Zhang
SEMI
Market and Industry Trend Forum
- Building the Future: Global Fab Investment, Capacity Dynamics & Materials Market Outlook
- Tuesday, September 9 from 3:55-4:20 p.m.
- Clark Tseng
Heterogeneous Integration Global Summit 2025 – Day 2
- Rethinking Connectivity: HiCONNECTS and the Chips that Power Tomorrow
- Thursday, September 11 from 11:50 a.m. – 12 p.m.
- Kartikey Srivastava
Siemens
IC Forum-Advanced Chip Technology and Manufacturing
- The Three Musketeers of Mask Synthesis: A Status Report
- Tuesday, September 9 from 2:15-2:35 p.m.
- Danping Peng
Smart Manufacturing Forum
- Beyond Simulation: Bridging the Real and the Digital World for Semiconductor Industry
- Thursday, September 11 from 2:25 – 2:50 p.m.
- Christine Herbst-Kubitz
TechSearch International
Heterogeneous Integration Global Summit 2025 – Day 3
- Keynote: AI Packaging Choices: Market and Technology Trends
- Friday, September 12 from 9 – 9:25 a.m.
- Jan Vardaman
Member Exhibits
