Smoltek has been granted three new patents since the start of the year. The patents are related to three different families: Interconnects, Assembly platform and Compact energy storage interposer. This makes our patent portfolio to now comprise 68 granted patents in total.

Smoltek’s 66th patent was granted in China and it further strengthens the position of our growth-related patent family of Interconnects in the forming of nanostructures and nanostructure devices.

“Through these three new patents, Smoltek again proves our ability both in technical and innovative capabilities of widening our IP footprint,” says Vincent Desmaris, CTO at Smoltek.

Smoltek’s 67th patent has been granted in Japan and relates to the Assembly platform family in the field of interconnects and heterogeneous integration. This particular patent family is a pathway to tap into the ever-increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level.

Smoltek’s 68th patent has been granted in the US and is covering the concept and manufacturing of extremely thin energy storage devices embedded in an interposer. Our energy storage device concepts may take many forms e.g. discrete, integrated or it can take the form where the end result is an interposer with CNF-MIM capacitors embedded in it. And the Compact energy storage interposer family is developed to capture around that concept.

Smoltek’s patent portfolio now globally comprises 68 granted patents. Read more about our IP and patents.

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Smoltek is a global technology provider for the new wave of advanced packaging and heterogenous…

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