Exhibitor Highlights at IMAPS International Symposium

Exhibitor Highlights at IMAPS International Symposium

The 52nd International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week. Key package platforms will include system-in-package (SiP), system in module (SiM). chip-package interaction (CPI), wafer level/panel Level, 2.5D/3D/flip chip/optical, as well as high reliablity/performance, and advanced process/materials. IMAPS 2019 will host over 125 technical presentations and posters on today’s most relevant topics in five parallel technical tracks, including 15 short courses and four keynotes from AMD, Analog Devices, Qualcomm and Teradyne, amongst 113 exhibitor booths.

More on the agenda, product previews and the like…

Sponsoring the exhibition lunch at the 2019 IMAPS International Symposium is MRSI Systems. The company has been a member and supporter of IMAPS for more than 30 years and will be showcasing its fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems at Booth #306. MRSI has been serving its optoelectronic and microelectronic customers for the past 35 years and understands the requirements to scale efficiently in today’s fast-paced marketplace. MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping, and eutectic bonding with scrub and temperature control are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.

Indium’s flux-coated solder preforms for the 5G infrastructure.

Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at Booth #507. The LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom termination components (BTCs), which do not allow for proper outgassing of volatized flux. In addition, Indium’s VP of Technology, Dr. Ning-Cheng Lee, will lead a professional development course, Achieving High-Reliability for Lead-Free Solder Joints – Materials Consideration. The goal of this course is to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.

Neu Dynamics, an international provider of manufacturing equipment for semiconductor packaging, handling, and assembly, will be joined by Boschman and SSI at Booth #601. Experts in turnkey semiconductor packaging solutions, Neu Dynamics also acts as the North American distributor for Kulicke & Soffa brand dicing blades. The new K&S HCL (High Competitive Line) Hub Blades series offers superior quality and valuable features that make it a highly competitive alternative to silicon wafer dicing.

AIT executives will be at Booth #316 ready to discuss its conformal coatings, EMI shielding, Snap Cure and Rapid Cure product line. AIT designs and manufactures one of the most comprehensive series of film and paste adhesives and interfaces for use in microelectronics and electronic packaging. Applications include die-attach, substrate and component attach, heatsink and heat pipe attach, gap-filling thermal interfaces, flexible circuit substrate and interposers, EMI shielding sheets and gaskets, and hermetic lid seals.

Experts from StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will be available to discuss the best types of packaging and assembly services for devices from DC to 63+ GHz at Booth #234. StratEdge RF and microwave packages target applications in the telecom, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole markets. These hermetic packages have ultra-low losses over wide frequencies. Their high-reliability designs have high thermal conductivity and 50 Ohm impedance transition designs. StratEdge packages have been proven on Mars, having powered the communications in the first Mars Rover throughout its lifespan, and are now functioning in the second-generation Mars Rover.

Exhibit Hours and Networking Events

  • MONDAY, SEPTEMBER 30, 2019:
    NO EXHIBITS | Exhibitor Move-in Only | Exhibits NOT OPEN to Visitors
    Network with the exhibitors at the Welcome Reception: 5:30 pm-7:00 pm
  • TUESDAY, OCTOBER 1, 2019:
    Exhibit Hall Open: 11:00 AM – 5:00 PM
    Lunch in Exhibit Hall: 11:30 AM – 2:00 PM
    Coffee Break in Exhibit Hall: 3:25 PM – 4:15 PM
  • WEDNESDAY, OCTOBER 2, 2019:
    Exhibit Hall Open: 10:00 AM – 6:15 PM
    Coffee Break in Exhibit Hall: 10:25 AM – 11:00 AM
    Lunch in Exhibit Hall: 12:25 PM – 1:45 PM
    Coffee Break in Exhibit Hall: 2:40 PM – 3:30 PM
    Happy Hour in Exhibits: 5:00 PM – 6:15 PM
  • THURSDAY, OCTOBER 3, 2019:
    NO EXHIBITS | Exhibitor Move-Out