Archives March 2018 - 3D InCites

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Advanced Packaging Trends – Part II: Solving Lithography Challenges

Part 1 of this advanced packaging (AP) article series focused on solving photoresist (PR) strip and under bump metallization (UBM) / redistribution layer (RDL) challenges. This article looks at AP trends from a lithography standpoint and proposes solutions to associated lithography challenges. The need for advanced packaging solutions is greater than ever as the world continues to demand increased... »

Designing and Integrating MCM/SIP Packages into Systems PCBs

Designing and Integrating MCM/SIP Packages into Systems PCBs

Traditionally, MCMs (Multi-Chip-Modules) were a way of integrating several ASICs, or ASICs and memory, into a lower-cost, smaller form-factor, robust module that was an alternative to a single large SoC. Instead of integrating all or most of the systems PCBs needs onto a large and complex single SOC, you could design and fabricate smaller, high-yielding ASICs (Figure 1) and make them behave like a... »

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

5G: Off the Fence Rail and into the Ring at IMAPS DPC 2018

The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and Augmented Reality are now things, having made it past 2008’s inflated expectations, and the disillusi... »

The Invention of NAND Flash Memory

The Invention of NAND Flash Memory

Part 3 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the invention of NAND flash memory. The above image is of the first comprehensive paper reporting the NAND Flash invention where Fowler-Nordheim tunneling is used for program and erase of the memory. [1] After the fundamental studies in the late 1960’s Quantum Mechanical tunneling... »

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

Let’s Face It, The Business of Self-driving Cars is About Profit, Not Saving Lives

How does the innovation of self-driving cars affect the business world we live in? This was the topic the iMAPS Global Business Council (GBC) chose to explore during its spring meeting two weeks ago, held in conjunction with the IMAPS Device Packaging Conference, March 6-8, 2018 in Fountain Hills, AZ. In traditional GBC fashion, the morning’s session started with a big-picture keynote presented ... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review, and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge semiconductor process control solu... »

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificia... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

Taking Stock and Redefining the Heterogeneous Integration Roadmap at IMAPS DPC 2018

As it has for the past 14 years, the global microelectronics industry gathered at Wekopa Resort and Conference Center in Fountain Hills, AZ, March 6-8, 2018, for the 2018 IMAPS Device Packaging Conference (DPC) to share knowledge, discuss strategies for growth, learn about the latest heterogeneous integration from fan-out wafer level packaging (FOWLP) to 3D ICs. We also managed to get in some golf... »

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

2018 3D InCites Awards Ceremony Raises $5500 for Children’s Health and STEM Education

March 7, 2018, the day of the 2018 3D InCites Awards Ceremony, dawned chillier than normal for this time of year in Fountain Hills, AZ. As they enjoyed their breakfast on the terrace outside the conference center, attendees of the 14th Annual iMAPS Device Packaging Conference (iMAPS DPC), may have noticed an artist hard at work creating an original mural that would later provide a backdrop to comm... »

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