Archives November 2015 - 3D InCites

IC Packaging: An Essential Enabler and Differentiator, Part 1

IC Packaging: An Essential Enabler and Differentiator, Part 1

The Great Miniaturization … SEMI/MEPTEC Conference Nov 10 & 11 After 50 years of following Moore’s Law and reaping major benefits with every feature size reduction, the economics of transistor scaling are now no longer universally applicable. Only designs that can be sold in extremely high volumes are likely to pay back the enormous up-front investment needed to get to production in a time... »

Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop

Takeaways from the 5th Annual IEEE Global Interposer Technology Workshop

More than 25 years ago, Professor Rao Tummala founded Georgia Tech’s Package Research Center. However, his vision that advanced IC packaging technology would “graduate” soon and play a major role in the semiconductor industry didn’t come true for a long time. About a decade ago, the first generation of advanced packaging technologies — package-on-package (PoP) and system-in-package (SiP)... »

The IPSO Alliance IoT Pavilion at Designers of Things Brings Smart Ideas to Life

The IPSO Alliance IoT Pavilion at Designers of Things Brings Smart Ideas to Life

Have you ever met someone who actually built a better mousetrap? What about someone who came up with the idea to add intelligence to otherwise mundane objects like a hospital food tray, radiator, or an ordinary concrete bolt? If you’re in San Jose for the Designers of Things Conference, December 2-3, you’ll find all this and more in the IPSO IoT Pavilion, where ten semi-finalists of the 2015 I... »

The Great Consolidation

The Great Consolidation

The recent MEPTEC – SEMI Symposium on “The Great Miniaturization” featured two days of talks on just that subject at the Biltmore Hotel in Santa Clara, CA, the week of November 9 2015. Thank you MEPTEC, thank you SEMI, and thank you to all speakers for the work you did preparing for, and then putting on, the symposium. It was my pleasure and my honor to moderate the panel discussion, which ... »

Flip Chip Technology: Which Companies will Invest to Support Growth?

Flip Chip Technology: Which Companies will Invest to Support Growth?

Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS Image Sensors (CIS) applications, the flip chip market is expanding. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and bumping houses are entering this market. The “More than Moore” market research ... »

High Performance Requirements are Driving the Graphics Market

High Performance Requirements are Driving the Graphics Market

Last June, AMD released a new generation of graphics card, Radeon™ R9 Fury X, dedicated to PC gaming applications and including High-Bandwidth Memories (HBM). The “More than Moore” market research and strategy consulting company, Yole Développement (Yole) announces a complete 3D & 2.5D packaging analysis & costing report focused on the HBM integrated on chip led by AMD and its partn... »

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

System Plus Consulting reveals the Samsung Galaxy S6 hidden technologies

The mobile phone industry has grown to produce more than 1.1 billion devices in 2014 (Source: Camera Module Industry report, Yole Développement, Aug. 2015). With every new model, smartphone manufacturers are trying to bring users a better experience, incredible functions, innovative design and new applications. But how are they manufacturing it? What are the real innovations at the device and mod... »

Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVs

Executive Viewpoint: Why the European 3D Summit is Going Beyond TSVs

Remember back a few years ago when 3D and TSV were considered to be the pretty much the same thing? Anne-Marie Dutron, general director of SEMI Europe Grenoble Office does. She was in the thick of it, working at ST Microelectronics Mobile Division in partnership with CEA-Leti and imec on 3D TSV partitioning. She also remembers the very early days of package-on-package (PoP), embedded die into BGA ... »

Dow Electronic Materials Wins Prestigious R&D 100 Award for  SOLDERON™ Tin-Silver Plating Chemistry

Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry

MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year. The chemistry joins six other Dow products honored by R&D Magazine at its R&D 1... »

Questions Answered at the 2015 MEMS Executive Congress

Questions Answered at the 2015 MEMS Executive Congress

This final post from my time at the 2015 MEMS Executive Congress addresses some random questions I had that were answered for me at this year’s event. Can MEMS and sensors help keep the IoT safe? Is there a difference between privacy and security? Many would say that there is; others are concerned about both. Those who grew up with the Internet aren’t concerned about their privacy, as they op... »

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