Archives January 2015 - 3D InCites

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier this month, as the company intensifies its focus on 3D TSV Advanced Packaging.  The company displayed and discussed its unique hardware and process technologies that reduce the cost of critical processes in advanced packaging. Process applications include advancemen... »

The Discussions Continue at the European 3D TSV Summit

The Discussions Continue at the European 3D TSV Summit

At last week’s third edition of the European 3D TSV Summit, over 250 attendees from 22 countries gathered at Minatec Campus in Grenoble, France to talk about how 3D enables smarter systems. The discussions seemed to picked right up from where we left off at the 3DASIP Conference in December and the GIT Workshop in November. Cost is a matter of perspective While Qualcomm is still waiting for in... »

Technology Options and Their Influence on Routing for Interposer-based Memory Processor Integration

Technology Options and Their Influence on Routing for Interposer-based Memory Processor Integration

Currently  in advanced integration, mainly stacked solutions (Figure 1b) are considered due to their attractive compactness. But if the ASIC or the processor is a high-performance circuit, there are problems with the thermal budget of the stacked solution. This is because the valid temperature range of the memory is limited. Designing a thermally balanced solution is very challenging and often en... »

Predicting the 3D Integration Market is Tricky Business

Predicting the 3D Integration Market is Tricky Business

Ask any market researcher or business development executive at a major semiconductor manufacturing company; predicting exactly when the 3D integration market is going to take hold and fly is a tricky business, because there are so many elements to consider. During this year’s European 3D TSV Summit pre-conference market briefing, January 19, 2015, it became obvious once again that this is still ... »

3D NAND Flash, El Capitan and Peacocks’ Tails – An Outlook for 2015

3D NAND Flash, El Capitan and Peacocks’ Tails – An Outlook for 2015

2014: That was a year that was! Many of you, perhaps remembering my outlook missive from last year, must be looking forward to how I would explain my piffle given the marvelous developments over the past year. Well, piffle it ain’t. Just more nuanced. I’ll explain but first, a recap of events: 2014 clearly belongs to Samsung. First, in February, they came with their ISSCC presentation with a ... »

What Does Success for 3D Integration Look Like?

What Does Success for 3D Integration Look Like?

For the third consecutive January, I spent 3 days in Grenoble attending the European 3D TSV Summit. Each summit has followed a specific theme that aligned with where 3D integration was in its evolution. Kevin Crofton, SPTS, summed it up nicely in his closing remarks this year. In 2013, we were “on the road to manufacturing”. The emphasis was on developing technology for 3D and heterogeneous st... »

Path Finding Series Part 3: The Cost of Non-robust Design

Path Finding Series Part 3: The Cost of Non-robust Design

In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s erratic yields can impact the manufacturing environment and cost of a product. A non-robust design will have at least one specification that is skewed away from the specification’s center as shown in Figure 1. But what happens if your design is NOT robust? Does the pro... »

What’s Different for 3D Stacked DRAM Equipment Shipments in 2015?

What’s Different for 3D Stacked DRAM Equipment Shipments in 2015?

Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked DRAM equipment shipments in 2015? Briefly, as presented in Part 1 of this thread, significant structural problems existed in the DRAM industry, present from the very beginning of 2012, that impeded the roll-out and adoption of 3D Stacked DRAM as a commercial product. Thr... »

Finding the Right Time and Place for 3D ICs

Finding the Right Time and Place for 3D ICs

As a cost modeling company, when we were asked to speak at 3D ASIP this past December, the initial topic choice seemed fairly obvious. We decided to tackle the question of whether the cost of 3D ICs will ever be low enough for HVM. We’ve done a lot of individual projects focusing on both interposer and 3D technology, so we have experience modeling both of those 3D architectures, but we have neve... »

What does 3D integration have in store for semiconductor and related industries in 2015?

What does 3D integration have in store for semiconductor and related industries in 2015?

Yole Développement invites you to discover the main technology trends and business opportunities for 3D integration in 2015. As a research market & strategy consulting company, Yole Développement (Yole) works with the leaders of the advanced packaging industry every day to understand technical challenges and market issues. In this article, Yole’s analysts detail their vision of the industr... »

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