Archives November 2014 - 3D InCites

3D By Design: PDKs Can Enable an Open Market for Interposer and 3D Solutions

3D By Design: PDKs Can Enable an Open Market for Interposer and 3D Solutions

As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is still performed in-house at integrated semiconductor manufacturers (ISM). However, ... »

Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers

Ultratech Introduces Superfast 4G Low-cost In-line Inspection System for Patterned Wafers

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today introduced the Superfast 4G high-volume, in-line, 3D topography inspection system. Ultratech’s new 4G system builds on the field-tested capability of the Superfast 3G, providing the industry’s highest-productivity and lo... »

Cleaning Up By Backing In: TSMC and Heterogeneous Integration at MEMS Executive Congress 2014

Cleaning Up By Backing In: TSMC and Heterogeneous Integration at MEMS Executive Congress 2014

“Go big or go home,” a waitress in a mountainy, remote, Wyoming town once said to a table of hikers, about ordering breakfast one summery day. Go big or go home are words Karen Lightman and team at MEMS Industry Group must have taken to heart for the 10th Annual MEMS Executive Congress, held at the JW Marriott Camelback Inn, Scottsdale, AZ, November 6-7, 2014. Taiwan Semiconductor Manufacturin... »

Congratulations Alexis Corona! Recipient of the 1st 3D InCites Awards Scholarship

Congratulations Alexis Corona! Recipient of the 1st 3D InCites Awards Scholarship

I’m pretty sure the time I got to spend last week at the SEMI High Tech U Graduation ceremonies was the most fun I’ve had all year. The event was held at KLA Tencor in San Jose, CA, November 13, 2014, and  I was invited to participate as a guest mock-interviewer, and also to present the very first 3D InCites Awards Scholarship, in the amount of $2500, to Alexis Corona, a deserv... »

3D ASIP 2014 Covers All the Bases from Design to Applications for Interposer and 3D IC Technologies

3D ASIP 2014 Covers All the Bases from Design to Applications for Interposer and 3D IC Technologies

One look at the agenda for the 11th Annual 3D Architectures for Semiconductor Integration and Packaging Conference (3D ASIP), and it becomes clear that this year the conference organizers have left no stone unturned. Kicking it off with Pre-conference Symposia that emphasize 3D design tools and flow and manufacturing processes, the event gets into full-swing on Thursday with sessions that span the... »

Will a Sensor-based Revolution Enable a World of Abundance?

Will a Sensor-based Revolution Enable a World of Abundance?

When I was a little kid, my (much older) brothers had to have PF Flyers, because according to the commercial on TV, they made you “jump high” and “run fast”. The Playtex Cross-Your Heart Bra boasted that it could “lift and separate”. And angle-necked Reach toothbrushes were the latest advancement in preventing tooth decay. How times have changed. At last week’s 2014 International Waf... »

European 3D TSV Summit Committee  Announces Keynote Speakers; Pre-Conference Symposium to Focus on the Market

European 3D TSV Summit Committee Announces Keynote Speakers; Pre-Conference Symposium to Focus on the Market

This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can help us create smarter systems. To help set the stage, the steering committee engaged a number of influential industry speakers to share their perspectives. Bryan Black, Senior Fellow, AMD will present new information in his talk, Die Stacking is Happening. From the world of the... »

MEMS Executive Congress 2014 Gives a Nod to Heterogeneous Integration and the Three Sisters

MEMS Executive Congress 2014 Gives a Nod to Heterogeneous Integration and the Three Sisters

If you are anyone doing anything important, or wanting to know anything important about MEMS and Sensors, then you were probably at the MEMS Industry Group (MIG)’s MEMS Executive Congress US 2014, from November 5-7, in Scottsdale, AZ. (Or else you were in Phoenix for the NASCAR race, which is why I couldn’t get the Avis car I had reserved. But that’s a different story.) The MEMS Executive Co... »

Can Product Design learn a Trick from Manufacturing?

Can Product Design learn a Trick from Manufacturing?

You might think this is crazy but bear with me for 421 words. Early in my career, I worked at an IDM as a product engineer and manager over IC products. ‘We’ were responsible for the overall product cost, maintaining yields (including speed binning) as well as improving yields. This was long before the SoC/ASIC disaggregation. This IDM was vertically integrated and had its own mask production,... »

Nordson DAGE Announces Latest Order for XM8000

Nordson DAGE Announces Latest Order for XM8000

Nordson DAGE, a division of Nordson Corporation, is pleased to announce its most recent order from a major customer in the semiconductor industry for its XM8000 wafer x-ray metrology tool that will be used for the automatic measurement of wafer bumps and through silicon vias (TSVs) by using 2D and 3D X-ray inspection methods. “The XM8000 represents an entirely new paradigm using Nordson DAGE’... »

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