Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013
The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, when Ranjith John... »
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