Archives May 2013 - 3D InCites

Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013 Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through Silicon Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, when Ranjith John... »

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

A*STAR IME, STATS ChipPAC and Qualcomm collaborate to develop low cost interposer technology

Singapore 29 May, 2013– Singapore’s A*STAR Institute of Microelectronics (IME), Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Incorporated, and STATS ChipPAC have announced a collaboration to develop technology building blocks for Low Cost Interposers (LCI) for 2.5D ICs. “2.5D/3D IC technology provides ample opportunities to further increase functionality and perf... »

3D IC Business Model: A Customer Decision

3D IC Business Model: A Customer Decision

After more than a year of touting the turnkey model, even TSMC is jumping on board the collaboration bandwagon for manufacturing 2.5D and 3D ICs at high volume. This revelation came this week at ECTC 2013 (May 28-31, Las Vegas) from TSMC’s Jerry Tzou, who was a panelist during the special session, “The Role of Wafer Foundries in Next –Gen Packaging.” Chaired by Sam Karikalan, Broadcom, the... »

ASMC 2013 and 3D IC: Time to Volume, Time to Via

ASMC 2013 and 3D IC: Time to Volume, Time to Via

What is today’s biggest threat to continued growth in the semiconductor industry? Subramani Kengeri, Vice President, Advanced Technology Architecture, GLOBALFOUNDRIES, opening the 24th annual SEMI Advanced Semiconductor Manufacturing Conference in Saratoga Springs, NY, asked just that question in his keynote address. (Asked it twice, actually; once at the beginning of his provocative talk, and o... »

IME's Through Silicon Interposer

SEMICON Singapore 3D IC Wrap-Up: Bring down the cost and bring out the TSV alternatives

For the 8th year in a row, I did NOT attend SEMICON Singapore. But apparently this is the year I should have been there to cover the 3D IC Forum, as it was well attended and had a robust program with 15 speakers and a panel discussion (at least that’s what IME’s Surya Bhattacharya said in a Skype interview.)  Luckily many of my industry contacts did attend (and participate) and were more than... »

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the a... »

Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5D/3D-ICs

Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5D/3D-ICs

WILSONVILLE, Ore., May 20, 2013—Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying individual dies in the us... »

2.5D Interposer wafer - TSMC

3D Super Chips, 2.5D Technology Advancements, and 3D through the EDA Lens

TSMC calls them 3D Super Chips. The rest of the industry calls it 3D heterogeneous integration. Whatever way you slice it, either 2.5D or 3D IC, it requires TSV technology for its method of interconnect. Here are a few recent items about the latest progress in the march to commercialization of both 2.5D and 3D ICs. EE Times journalist, R. Colin Johnson recently scored an exclusive interview with T... »

Catching up with EV Group’s Dave Kirsch

Catching up with EV Group’s Dave Kirsch

Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV Group North America. Since EV Group launched a tool last week at SEMICON Singapore, and since EVG NA’s headquarters are practically in 3D InCites’ back yard, I thought it was time to check in and catch up with Kirsch to find out more about this tool launch, and the company’s activities in the ... »

SPTS Ships 1000th DRIE Process Module

SPTS Ships 1000th DRIE Process Module

Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the company had reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. This announcement was made at the SE... »

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