Latest Posts - Page 3
Check this out: easier debonding?
It’s common knowledge among those working feverishly to bring 3D TSVs to market that one of the areas still being...SUSS MicroTec: A 3D Approach
Today in 3D: HMCC Drafts Specs; Materials Suppliers take on TB/DB; OSATS add Capacity
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news,...An Incomplete List of 3D Solutions
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are...Dow Corning and SUSS MicroTec Collaborating on Temporary Bonding Solution for Semiconductor Packaging
Dow Corning, supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, supplier of semiconductor processing...SUSS MicroTec launches platform for permanent wafer bonding, debonding and cleaning
SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume...Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling,...EV Group: Progress on Advanced C2W Bonding
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking...Rudolph Technologies Collaborates in 3D Advanced Packaging Integration
Rudolph Technologies, Inc., provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced that it...
