Latest Posts - Page 3
Community Member Monthly Highlights — May
SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027,...
Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
Siemens has collaborated with leading Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries Co., Ltd. (SPIL) – (Image courtesy...The Rise of Organic and Glass Substrates
If you are designing a heterogeneously integrated, multi-die, high-performance device for markets such as HPC, AI, data centers, etc., then...
IFTLE 556: Is Chiplet Partitioning a New IC Design Paradigm?
While most of us in advanced packaging is familiar with CEA-Leti, CEA-List ( Laboratoire d’Intégration de Systèmes et des technologies)...
A Newcomer’s Perspective of the 2023 North America TSMC Technology Symposium
For the first time in 3D InCites’ history, I was invited to attend a TSMC Technology Symposium, which took place...
IMAPS DPC Community Member Preview
The 19th Annual Device Packaging Conference (DPC 2023) is scheduled for next week, March 13-16, 2023, at the WeKoPa Conference...
An Epic Chiplet Evolution
Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in...
Community Member Monthly Highlights — January
SEMI announced that SEMICON West will move to Phoenix on a five-year annual rotation, beginning in 2024, and will shift...
Community Member Preview: Chiplet Summit
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968,...
Chipletz Selects Siemens’ EDA Solutions for its Smart Substrate IC Packaging Technology
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic...
Community Member Monthly Highlights – December
Happy Holidays! Here’s the last of our community news round-up for 2022. Can’t wait to see what’s in store for...
Community Member Monthly Highlights — November
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new...
IFTLE 541: Predicted Locations for CHIPS Innovation Hubs; Skywater/BRIDG IBAS Funding
CHIPS Act Innovation Hubs SEMI has published an interesting article where they predict 10 likely locations for CHIPS Act Innovation...
SEMICON Europa 2022 Member Preview
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving...
Siemens Expands Industry-leading Integrated Circuit Verification Portfolio with Acquisition of Avery Design Systems
Acquisition will extend Siemens’ enterprise verification platform, adding Avery‘s Verification Protocol and Compliance Test Suite offerings Customers can optimize quality...
Community Member Monthly Highlights – October
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
Siemens Launches Innovative Cloud-native Software for Electrical Design
Siemens’ Capital™ Electra™ X is a new cloud-native electrical design software aimed at individual electrical designers or small teams that...
Siemens’ Aprisa Digital Implementation Solution Certified for Samsung Foundry’s Advanced 4nm Processes
Siemens Digital Industries Software today announced that Samsung Foundry has certified Siemens‘ Aprisa™ solution for the foundry’s advanced 4nm FinFET...
