More than Moore

New Details About More-than-Moore Test Technology Advances

New Details About More-than-Moore Test Technology Advances

SEMICON West and the Electronic System (ES) Design West were, for the first time, co-located at the Moscone Center in San Francisco, from July 9 to 11, 2019. In addition to most keynotes, I reported about here, This blog talks about some in-depth technical presentations on test and the progress many companies made in support of “More than Moore” technology. The Test Vision Symposium The most i... »

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »

More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available. The book addresses the current status of More-than-Moore system-in-package (SiP) technologies and explores the technical and business tradeoffs for deploying these options in high volume commercial IC products. We’re pleased to provide an excerpt of the preface: “There is a lot of... »

What is Driving the Advanced Packaging Market in China?

What is Driving the Advanced Packaging Market in China?

Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015, announces Yole Développement (Yole). This market is showing an impressive 16% CAGR[1] during this period. China has the world’s largest po... »

Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities

Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities

My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge and opportunity. What can we, in the 200-year-old  US of A, learn from the 4000 years old Chinese culture? The Chinese have a point! Based on my personal experience, I have to say that every challenge I faced so far, opened a door to a new opportunity, making my life better and more interest... »

From the Ashes of Moore’s Law: More than Moore Has Arrived

From the Ashes of Moore’s Law: More than Moore Has Arrived

Now that the industry has finally called it a day for Moore’s law, will More than Moore be our guiding star for innovation? Analysts have been predicting the demise of Moore’s law for about as long as I have been covering 3D integration technologies. During that time, Intel has steadfastly refused to succumb to that sentiment, and has continued to pursue ways to continue CMOS scaling. That... »

The More-than-Moore Supply Chain Dream has Become a Reality

The More-than-Moore Supply Chain Dream has Become a Reality

The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC) industry. Today, LEDs, MEMS, and power devices have all integrated semiconductor manufacturing processes. But what is the status of the More-than-Moore supply chain? Yole Développement (Yole) and Serma Technologies (Serma) have partnered to create... »

Flying Many Flags: Heterogeneous Integration at CS International 2015

Flying Many Flags: Heterogeneous Integration at CS International 2015

The fifth annual CS International Conference, 2015 edition, was held in Frankfurt, Germany, March 11-12, 2015. Very conveniently located in the Sheraton Frankfurt Airport Hotel & Conference Center, just steps away from where I deplaned in Frankfurt after my flight from Dulles.  Over the course of its 2 days, CS International 2015, offered 6 major themes, spread over 37 individual presentati... »

RIP ITRS V1.0: 1992-2015

RIP ITRS V1.0: 1992-2015

Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their customers that defined product roadmaps. Vendors cared little about accepting or supplying work-in-progress (WIP) to other vendors’ products. But it became obvious to many that unless they were coordinated, sales potential would be limited. A coordina... »

Silicon Saxony: Leading the Charge in More than Moore

Silicon Saxony: Leading the Charge in More than Moore

Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development in Europe. And since the reunification, Dresden has focused its investments on a single area: high technology and affiliated research. Both GLOBALFOUNDRIES and Infineon have a significant presence here, as well as many divisions of the Fraunhofer-Gese... »