Latest Posts
SEMICON West Keynotes Look to a Future Beyond Moore’s Law
In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West...
More-than-Moore 2.5D and 3D SiP Integration
A new book on 2.5D and 3D integration, written by Riko Radojcic and published by Springer, will soon be available....
What is Driving the Advanced Packaging Market in China?
Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced...
Transforming Today’s Semiconductor Industry Challenges into Tomorrow’s Opportunities
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge...
From the Ashes of Moore’s Law: More than Moore Has Arrived
Now that the industry has finally called it a day for Moore’s law, will More than Moore be our guiding...
The More-than-Moore Supply Chain Dream has Become a Reality
The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC)...
Flying Many Flags: Heterogeneous Integration at CS International 2015
The fifth annual CS International Conference, 2015 edition, was held in Frankfurt, Germany, March 11-12, 2015. Very conveniently located in...
RIP ITRS V1.0: 1992-2015
Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their...
Silicon Saxony: Leading the Charge in More than Moore
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
