Latest Posts
3D TSV Test Approaches: Outlook for 2014
Metrology, process control, and electrical test are key enablers for the success of the semiconductor industry. 3D integration using TSVs...
3D Test Community Addresses Requirements for 3D Volume Production Testing
Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on...
FormFactor Tackles Probe Test for 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
FormFactor: NanoPierce Contactor
Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC...
2013 3D Test Workshop Call for Papers
The 2013 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package...“Known Good Die” has a new name
After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry...
