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Are you ready for an exciting week at SEMICON Taiwan 2025? From September 8-12, more than 1,100 semiconductor companies from around the world will gather at the Taipei Nangang Exhibition Center to network, share insights, and plan for the future. As the industry gets closer to reaching its $1 trillion...
Semiconductor Industry Visionaries Will Headline the Region’s Most Influential Strategic Summit to Discuss Pressing Challenges As SEMICON Southeast Asia (SEA), the region’s flagship event for the global electronics manufacturing and supply chain community, prepares to host its inaugural and highly anticipated CEO Summit, an exceptional lineup of international industry leaders has been confirmed...
Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering the AI Era, the event will showcase how the semiconductor industry is driving AI technology. We’re excited to share that SEMI, one of our member companies, has achieved record sales...
An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced...
Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end...
Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of our national political campaigns; a winter of welcome, abundant, Northern California rains; along with a plethora of riches in the Silicon Valley conference, symposium, and seminar vein. Take the January...
As we move into the final quarter of the year, October marks the annual gathering of Europe’s microelectronics industry at SEMICON Europa. This year’s show, which took place October 6-8, 2014, once again attracted the leading players from across the industry value chain, but with an added French twist of...
MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs simulator tool. Industry professionals from 35 countries across the globe have downloaded the tool directly from the company’s website over 240 times. The MonolithIC 3D team has developed the open-source...
