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While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...
As many of you know, this year’s SEMICON Europa in Munich is a special one for 3D InCites. The Queen of 3D is retiring, and SEMICON Europa marks her last industry event. Over the course of her career, she has played an instrumental role in the advanced packaging industry. From...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is highlighting its industry-leading IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, as well other wafer bonding and lithography technologies, at the SEMICON Korea 2025...
With SEMICON Europa not too far behind us, the industry is already gearing up again for SEMICON Japan. Taking place from December 11-13, this year’s Japan event will feature interactive sessions that we haven’t seen before, including Yoichi Ochiai’s Passion Lab and SEMICON Stadium, where participants will get to engage...
3D InCites is excited to head to Munich this November for another incredible SEMICON Europa event! With three feature presentations, booth parties, and dozens of presentations from 16 member companies, there’s something for everyone to look forward to. From November 12-15, SEMICON Europa attendees will get access to hundreds of...
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts will be on hand to discuss how our AOI, SPI and DPI solutions boost your quality and...
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of...
Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan...
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart”...
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At all of these events, the themes were consistent: advanced packaging rules; automotive and IoT is driving...
