Siemens News - Page 3
Chipletz Selects Siemens’ EDA Solutions for its Smart Substrate IC Packaging Technology
Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic...
Siemens Expands Industry-leading Integrated Circuit Verification Portfolio with Acquisition of Avery Design Systems
Acquisition will extend Siemens’ enterprise verification platform, adding Avery‘s Verification Protocol and Compliance Test Suite offerings Customers can optimize quality...
Siemens Launches Innovative Cloud-native Software for Electrical Design
Siemens’ Capital™ Electra™ X is a new cloud-native electrical design software aimed at individual electrical designers or small teams that...
Siemens’ Aprisa Digital Implementation Solution Certified for Samsung Foundry’s Advanced 4nm Processes
Siemens Digital Industries Software today announced that Samsung Foundry has certified Siemens‘ Aprisa™ solution for the foundry’s advanced 4nm FinFET...
Siemens Automates 2.5D and 3D IC Design-for-test with New Tessent Multi Die Solution
Siemens’ Tessent Multi-die software helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based...
How to Achieve Advanced IC Packaging Verification and Signoff
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT)...
Proposed Standardization of Chiplet Models for Heterogenous Integration
With the economics of transistor scaling no longer universally applicable, the semiconductor industry faces an inflection point as higher cost,...
Using a System Technology Co-Optimization (STCO) Approach for 2.5/3D Heterogeneous Semiconductor Integration
With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support...
Heterogeneous Chiplet Design and Integration: A New Twist for SiP Design
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Siemens Joins Intel Foundry Services’ EDA Alliance program
Siemens Digital Industries Software today announced it has become a charter member of the Intel Foundry Services (IFS) Accelerator –...
Siemens Collaborates with UMC on Design Kits for Automotive and Power Applications
Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs)...
A Proven Methodology to Meet Manufacturing Process Requirements for Metal-filled Areas and Planes
In this paper, we review the three methodologies commonly used to achieve foundry/OSAT requirements for metal-filled areas and planes in...
Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration
Moore’s law is increasingly difficult to maintain. With the economics of transistor scaling no longer universally applicable, the industry is...
Heterogeneous Chiplet Design and Integration
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Using Calibre for Advanced IC Packaging Verification and Signoff
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT)...
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...