Siemens News - Page 3
How to Achieve Advanced IC Packaging Verification and Signoff
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT)...
Proposed Standardization of Chiplet Models for Heterogenous Integration
With the economics of transistor scaling no longer universally applicable, the semiconductor industry faces an inflection point as higher cost,...
Using a System Technology Co-Optimization (STCO) Approach for 2.5/3D Heterogeneous Semiconductor Integration
With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support...
Heterogeneous Chiplet Design and Integration: A New Twist for SiP Design
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Siemens Joins Intel Foundry Services’ EDA Alliance program
Siemens Digital Industries Software today announced it has become a charter member of the Intel Foundry Services (IFS) Accelerator –...
Siemens Collaborates with UMC on Design Kits for Automotive and Power Applications
Siemens Digital Industries Software today announced it has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs)...
A Proven Methodology to Meet Manufacturing Process Requirements for Metal-filled Areas and Planes
In this paper, we review the three methodologies commonly used to achieve foundry/OSAT requirements for metal-filled areas and planes in...
Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration
Moore’s law is increasingly difficult to maintain. With the economics of transistor scaling no longer universally applicable, the industry is...
Heterogeneous Chiplet Design and Integration
A number of factors are converging and driving the chiplet design revolution. To start with the economic advantage of silicon...
Using Calibre for Advanced IC Packaging Verification and Signoff
To satisfy industry demand for continued increases in electronic functions per unit area, foundries and outsourced assembly and test (OSAT)...
Siemens and ASE Introduce Enablement Technologies for Next-generation High Density Advanced Package Designs
Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement...
