Francoise News - Page 56
Setting the record straight on TMV and TSV
After attending Curtis Zwenger’s presentation introducing Amkor’s latest contribution to the package-on-package (PoP) family based on the company’s proprietaryOther 3Ds: HIDING DIES/HERMES projects update
Tuesday’s post, which referenced the Fraunhofer IZM’s work in embedded die technologies to achieve 3D packages, reminded me that I...eWLB hits the big time
Sometimes I get so caught up in following the progress of 3D IC with TSV that I lose sight of...TechVenture Forum covers 3D from A-Z
I just took a good look at the line-up for the 3-D Architectures for Semiconductor Integration and Packaging, coming up...Suppliers offer solutions to TSV formation challenges
As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in...
Another step forward for EDA Tools
I have to admit, I’ve always had difficulty trying to wrap my head around software, especially design tools. So I’ve...From the DPC: Panelists address burning questions for 3D IC integration
I’m glad I stuck around last evening for the 3D panel discussion on the status of 3D integration technologies, applications...3D Architectures: Day One Talking Points
They brought in a few of the big guns today (Intel, IBM, TSMC) to offer perspectives and updates on the...Filled vs. conformal vias: the consensus
Dr. Zhang, I think we have reached a verdict.Bob Patti wrote in to confirm Anonymous Caller’s statement...
