Ok, maybe I should say Gartner’s crystal ball, but whenever Jim Walker delivers a presentation based on Gartner research, he...
In developing an application to integrate 128 processors on a single chip, ST Microelectronics turned to Leti for assistance. To...
As human beings, we take a lot of things for granted; breathing, for example, or our heart beating when it...
EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN,...
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when...
Every once in a while it helps to step back and take a look at the big picture. For me,...
Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010...
Guest contributor, Herb Reiter, reports from the Sept 13 meeting of the GSA’s 3D/TSV EDA Interest Group, where 55 attendees,...
I love field trips. This week, I took one over to historic old town Chandler, AZ, where IMAPS Arizona chapter...
The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner...
Every once in a while, it’s helpful to step back and get a broad view of what’s going on in...
Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for...
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as VP R&D and CTO. In this function Rainer Knippelmeyer will oversee research...
You know how sometimes you feel like you know a person you haven’t actually met because you read something they...
In an ongoing effort to drive 3D IC integration, SEMATECH’s 3D Interconnect program has completed its 300mm 3D IC pilot...
A critical challenge for fabricating 3D products is the integration of the dies with through-silicon vias (TSVs) into functioning and...
My recent visit to EV Group at its headquarters in Schärding, Austria, included some time spent with M. Jürgen Wolf,...
SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement...
Today’s side trip to the GSA’s 3D EDA Interest Group’s bimonthly meeting (sandwiched between IEDM 2011 and RTI’s 3D Systems...
