Francoise News - Page 29
Moore’s Law is Dead (or Dying) Again?
All good things must come to an end, and apparently Moore’s Law is one of them. But I have to...
Getting back to Basics: a Look at 3D NAND and 3D DRAM
There’s been a lot of buzz around 3D NAND in the past few weeks, sparked by Samsung’s recent announcement that...
Dynaloy: A Formula for Cleans
It’s hard to believe that inside such a non-descript building set back down a picturesque country lane in (almost) rural...
Understanding The Complexity of Cleans
There is nothing like a little hands-on experience to help someone understand a particular technology better and more fully. Last...
Playing the 3D IC Glad Game
I admit it. I have always been a card-carrying member of the Pollyanna Club. What’s wrong with approaching challenges with...
Multitest: Handling the Mobility Market
What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of...
FormFactor Tackles Probe Test for 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long...
SSEC’s New Chemistry for TSV Reveal
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a...
How will the 450mm Transition Affect Advanced Packaging and 3D ICs?
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual...
Alchimer Streamlines Wet Approach
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development...
SETNA: Atmospheric Plasma Surface Modification
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known...
Dow Corning offers the Power of Silicone Technology
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...
Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
EV Group: Never a Dull Moment
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with...
NORDSON: Newcomers to 3D ICs
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs...
Interview with imec’s Ludo Deferm: Packaging Design Kits and Debond Solutions
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought...
Silicon Photonics: the Next Killer App for 3D ICs? and more from the R&D Community
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization...
It Takes an Ecosystem to Launch 2.5D and 3D Integration
As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our...
