Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced it has partnered with Impress foundation to co-host the third annual 3D InCites Awards during SEMICON West 2015. 3D InCites also announced this year’s proceeds will fund two STEM-based academic scholarships: SEMI Foundation’s SEMI High Tech U Program, which provides secondary school students with an introduction to the high tech industry; and the IEEE Frances B. Hugle Engineering Scholarship, established by TechSearch International to encourage young women to follow in Hugle’s footsteps and pursue a career in engineering.
The 3D InCites Awards recognize achievements that further the commercialization of 3D integration technologies. Awards are presented to companies whose innovative products have contributed significantly to the advancement of through silicon via (TSV) technologies and other innovative processes that enable interposer integration, 3D ICs, monolithic 3D ICs, 3D memory, and 3D heterogeneous integration. In addition to individual category awards decided by an independent panel of industry expert judges, the 2015 3D InCites Awards will also feature The Readers Choice Award, to be presented to the nominee that received the most online votes on 3DInCites.com. The winners will be announced on Thursday, July 16, 2015 at the 3D InCites Awards Breakfast during SEMICON West 2015 in San Francisco.
A panel of independent industry experts will judge the 2015 awards program based on innovation, solution to a problem, and cost-of-ownership. Awards will be presented in the following categories:
• Devices (including interposer, 3D IC, 3D Memory, Heterogeneous Integration)
• Design Tools (includes EDA and Design for Test)
• Manufacturing Equipment (includes handling equipment)
• Inspection/Metrology Tools
• Test Tools/Equipment (includes probe cards/testers)
Nominations open March 31, 2015 and will be accepted through June 26, 2015. Only products that have not been previously nominated for a 3D InCites Award will be considered. Online voting will open on June 22, and close July 9, 2015. Program details, nomination criteria, and an online nomination form are found at https://www.3dincites.com/3d-incites-awards.
The awards will be presented during SEMICON West 2015 at the 3D InCites Awards Breakfast on Thursday, July 16, 2015. Winners will receive a handsome display award and the right to use the 2015 3D InCites Award identity for its own promotional purposes. Nominees and Winners will also be featured in an awards spotlight on www.3DinCites.com.
Sponsorship opportunities for 3D InCites Awards 2015 are now available for companies who wish to promote their business through this event and support the Frances B. Hugle Engineering Scholarship and SEMI High Tech U. For more information, contact awards@3Dincites.com.
About 3D InCites
3D InCites is the fastest growing online resource devoted exclusively to interposer integration 3D IC, and 3D heterogeneous integration technologies. For 3D integration to happen requires open collaboration across the supply chain. Therefore, 3D InCites strives to inform key decision makers about progress in technology development, design, standards, and infrastructure in order to realize commercial production of interposer integration and 3D IC technologies. For more information visit www.3DinCites.com.
3D InCites Contact:
Françoise von Trapp
Impress Foundation Contact: