Alchimer S.A. provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, has named Erik C. Smith chief operating officer.
Smith has nearly 25 years of experience in the semiconductor industry in the U.S. and Asia, including five years as president and COO of Qcept Technologies, a manufacturer of inspection systems for detecting non-visual defects (NVDs) on wafers. In addition to day-to-day operations, Smith was responsible for product development, applications, and sales and marketing.
He also served for 12 years in a variety of management and senior executive positions at Ultratech Inc., including senior vice president of worldwide sales and marketing. In that position, Smith reportedly helped Ultratech achieve market shares of greater than 80% in the advanced packaging lithography business and greater than 90% for 300mm products at semiconductor IDMs. As managing director of Ultratech K.K., he helped launch Ultratech’s Japanese operations.
“Erik Smith is an excellent fit for Alchimer as we continue to demonstrate the technological and economic benefits of our electrografting process for TSVs and IC interconnects,” said Steve Lerner, CEO of Alchimer. “Erik’s proven record as a COO, combined with his sales and marketing expertise and his in-depth experience in Japan, China, and other Asian markets, will help Alchimer capitalize on the momentum we have created around the globe.”
“Alchimer is providing the technology and cost-of-ownership (CoO) alternatives that are increasingly required in the More than Moore era,” Smith said. “Whether it is providing the OSATs with an enabling process for interposers or providing the full solution for the TSV stack and IC interconnects, I look forward to helping the company deliver on the promise that electrografting offers 3D interconnects.”
Smith will be based in Silicon Valley.