Semiconductor test and advanced packaging service provider (SATS) STATS ChipPAC announced it has has expanded embedded Wafer-Level Ball Grid Array (eWLB) technology — jointly developed by STATS ChipPAC, Infineon, and ST Microelectronics — to reconstituted 300mm wafers. STATSChipPAC is reportedly the the first in the semiconductor industry to introduce 300mm eWLB wafer manufacturing capabilities.
Adding capacity through 300mm wafer manufacturing is said to provide higher efficiency and economies of scale ascompared to the existing 200mm eWLB wafer format. STATS ChipPAC has invested more than $100M in eWLB technology. STATS ChipPAC’s current quarterly shipments of eWLB are reportedly in excess of 30,000 reconstitued wafers, with expected yields of 99% and above by the end of 2010.
“The 300mm eWLB wafer manufacturing accomplishment is a milestone for the industry and
is the result of leveraging the strengths of STATS ChipPAC and its manufacturing partner,
Infineon Technologies. Today, STATS ChipPAC is the world largest and leading volume
manufacturer in eWLB and the continued growth of capacity and transition to 300mm wafer
manufacturing will further position us to deliver a high performance solution at a lower cost
point for our customers,” said Dr. Han Byung Joon, Executive Vice President and Chief
Technology Officer, STATS ChipPAC. “We believe the exclusive relationship we have with
our eWLB technology development partners ensures that STATS ChipPAC will continue to
build a strong portfolio of advanced solutions for our customers.”
The eWLB technology has already been proven and adopted by many major mobile handset manufacturers to meet the relentless market demand for complex and power efficient semiconductor devices within a continuously shrinking package footprint. Development work continues on the eWLB evolution to enable larger package sizes, higher Input/Output (I/O) density and 3D Package on Package (PoP) solutions to address a wider application market.