With pioneering intellectual property and global services, SHELLBACK provides advanced process equipment, upgrades, and services to enable key markets such as power devices, photonics and LED, MEMS and sensors, wireless and analog, memory and storage, and advanced packaging. SHELLBACK provides proven advanced wet cleaning solutions, ideal for advanced packaging processes including UMB etch, photoresist strip, flux and polymer removal. Our industry-proven SEMITOOL batch spray product line features TORRENT® - the evolution of our proprietary SEMITOOL technology up to 300mm. SEMITOOL TORRENT features our Enhanced Spray Technology™ (EST) for unparallel performance and can be configured for clean, etch, or resist strip with acid, solvent, ozone (for dramatic chemical reduction) or hybrid versions to best suit your needs. Our extensive wet clean & etch portfolio also includes our 2023 acquisition of TEL/FSI MERCURY™ and MERCURY™+, an industry favorite for Low CoO, high throughput applications., Mercury+ is ideal to address advanced cleans and resist strip applications for 100mm to 200mm applications. We also provide parts and upgrades support for FSI MERCURY users. This includes our popular FSI MERCURY Control System Upgrade to address obsolescence with new components, software, and a stunning graphical user interface. Fully Automated batch spray options are available for both TORRENT and MERCURY+. We provide tailored high throughput / low CoO solutions to maximize your productivity with proven batch spray technology. See more information at shellbacksemi.com
