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Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
Discover advanced semiconductor packaging and assembly solutions tailored for high-frequency applications StratEdge Corporation, an industry leader in high-frequency and high-power...
Considerations in Power Amplifier Package Design
Understanding the role of compromises and trade-offs in the design process Electronic packages serve many purposes including protecting, connecting, and...
Will An Adhesion Promoter Prevent Delamination in Power Semiconductor Packages?
Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid...
StratEdge Increases Manufacturing Capacity of Small Outline Glass Sidewall Thermally Enhanced Packages for Power Semiconductors
StratEdge announces the increased capacity for manufacturing the small outline thermally enhanced alumina/glass sidewall packages for power semiconductors. The increased...
Increasing the Conductive Density of Power Packaging
March 3, 2021 – Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such...
Getting a Good Signal: StratEdge’s High-Performance Power Amplifier Packages on the Red Planet
Santee, Calif. — February 4, 2021 — StratEdge Corporation, a leader in the design and production of high-performance semiconductor packages...
