Latest Posts - Page 2
The Fraunhofer Cluster for 3D Integration Looks at the Big Picture
Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of...
Silicon Saxony: Leading the Charge in More than Moore
Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development...
2.5D Interposer Innovations from Silex and eSilicon
2.5D interposers sparked a good amount of discussion at this year’s 3D ASIP conference (December 11-13, 2013, Burlingame CA), with...
GIT 2013: One Silicon Guy’s Perspective
A 3D conference (or 2.5D workshop) wouldn’t be a 3D conference (or 2.5D workshop) without someone announcing the push-out of...
Notes from GIT 2013
The 3rd annual Global Interposer Technology Workshop (GIT 2013) was held at the Georgia Institute of Technology on November 18-20, 2013....
Triton Microtechnologies Receives Funding to Ramp Glass Interposer Manufacturing for 3D and 2.5D Semiconductor Packaging
Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposer technology that enables advanced semiconductor-packaging solutions, has met six-month...
3D ICs for High Performance Systems
A recent IEEC and IEEE CPMT workshop held on October 16, 2013 at Binghamton University in New York examined the...
Alchimer Streamlines Wet Approach
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development...
Semi Trade Pubs Talk 3D, Just in time for SEMICON West
That Jan Vardaman, she’s so clever! I just finished reading her column on ECTC 2013 in Printed Circuit Design and...
The Hills are alive – in the Hill Country – The Interposer workshop in Austin
Did anyone miss the Sound of Music bit during the Oscars? Anyway, with the sounds of “The Hills are alive..”...
