EMIB

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology

Book Review: Advances in Embedded and Fan-out Wafer Level Packaging Technology

When asked by Beth Keser and Steffen Krönert to review their new book, Advances in Embedded and Fan-out Wafer Level Packaging Technology, I was a little apprehensive. I reminded them that I was NOT an engineer, so would only be able to review it from the layperson’s perspective. They assured me that was precisely what they were looking for, so I agreed. Written by Experts When the book arrived ... »

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here

At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been waiting for, literally for over a decade. The Foveros Backstory In late 2006, CEO Paul Otellini displayed a 300mm wafer of 80 core microprocessors (Figure 1) and announced that such technology would soon be in production. In 2007 Bryan Black (later of AMD), Morrow and other Intel res... »

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll focus on the key take-aways from the other three keynote talks that... »

TechSearch International Makes Sense of Package Alphabet Soup

TechSearch International Makes Sense of Package Alphabet Soup

With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI, and SLIT are high-density substrates witho... »

The Intel Developer Forum 2014

The Intel Developer Forum 2014

This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have become more energy-conscious, so took the train to get there and back. On my way back I didn’t have to concentrate on the traffic around me and had time to think about what I learned from Intel’s keynotes and Mega-sessions on the first day. For many years, Intel has been the world’s largest... »