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IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here
At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been...
The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2
Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on...
EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016
This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number...
TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the...
The Intel Developer Forum 2014
This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have...
