Latest Posts
Electromagnetic Modeling of Three-dimensional Integrated Circuits
Three-dimensional Integrated circuits (3DIC) are generating increased interest as a way to increase speed and density while reducing power and...
3D/TSV Officially Recognized as Advanced Manufacturing Technology at SEMI ASMC 2016
As Dick James, Chipworks, puts it, the SEMI Advanced Manufacturing Conference is “… an annual conference focused on the manufacturing...
At 3D ASIP 2015, Variety is the Spice of Life
Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s...
Popping the Cork on 3D IC at IEEE 3DIC 2014
The IEEE International Conference on 3D System Integration (3DIC) was held in Kinsale, Cork, Ireland in December, 2014. The three...
SEMICON West 2014: Are 3D ICs Getting the Squeeze?
With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm...
Atoms Don’t Scale: What is Beyond 7nm (2019)?
We have a guest contribution today from Brian Cronquist, MonolithIC 3D Inc.’s VP of Technology & IP. Brian discusses about...
Dow Corning offers the Power of Silicone Technology
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview...SPTS Debuts Low-Temperature PECVD Technology for 3D-IC
SPTS Technologies has launched its low temperature plasma-enhanced chemical vapor deposition (PECVD) solution for via-reveal passivation in 3D-IC packaging applications....June Event Highlights in 3D
Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D...
EDA Approaches to 3D IC Tools
When I was in high school and then in college, I used my mother’s Smith-Corona MANUAL typewriter to write all...Ziptronix CTO to Speak at RTI Meeting on 3-D Architectures For Semiconductor Integration and Packaging, Dec. 14
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...SEMATECH Reports Advances in Bond Process for 3D Integration Development
With a focus on providing cost-effective and reliable solutions to accelerate manufacturing readiness of 3D technology options, SEMATECH experts reported...SEMATECH Forum Promotes 3D Interconnect Standards Development
SEMATECH has announced a new online 3D Standards Dashboard solution to help meet the demand for an open, centralized forum...The 3D Ball is Rolling…
I have to admit, after the first day of IMAPS Device Packaging Conference last week, I was thinking, “Well, that...Elephants, Bunnies, and Sandwiches: A Few Favorite Things from the GSA Memory Conference
Symbolism and analogies were flying fast and furious yesterday at the GSA Memory Conference in San Jose, CA. which addressed...