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Nordson Electronics Solutions Enables Seamless Integration of actnano PFAS-free Coatings with ASYMTEK Select Coat® Conformal Coating Systems

Sep 23, 2025

Simplify sustainability by reducing energy, eliminating curing ovens, and enhancing throughput with environmentally conscious conformal coating solutions Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials. This integration offers electronics manufacturers a proven path to...

The Evolution of Interconnects in Microelectronics Packaging

Nov 11, 2024

Semiconductor packaging is a complex and evolving field, involving multiple disciplines. As a microelectronics packaging engineer, I focus on the “interconnect thread” from the chip to the system (Figure 1). To me, packaging is about interconnectivity (essentially). The primary function of packaging is to provide the interconnection from the IC...

Community Member Highlights for September 2024

Sep 30, 2024

As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities. The industry event season kicked off with SEMICON Taiwan and SEMICON India, IEEE 3DIC, MEMS & Imaging Sensors Summit, and more, and our members actively participated. Many of them were...

SEMICON West 2024 “Stronger Together” Member Preview

Jun 25, 2024

SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration and it carries through to this flagship event. From July 8-11, 2024. Join us in San Francisco at the Moscone Center for insights into semiconductor industry market trends and to...

Packaging, Connecting, and Integrating: 30 years of Fraunhofer IZM – 30 years of packaging and interconnection excellence in microelectronics

Sep 21, 2023

September 20, 2023 The Fraunhofer Institute for Reliability and Microintegration IZM is marking its thirtieth year with a high-profile international conference in September. The Institute that now employs more than 400 people at its three sites was founded by twenty-one German scientists on a mission. Its main site in the...

It’s Spring and ESG Reporting Season is Underway!

May 23, 2022

When this blog publishes it will have been about a month from Earth Day. Earth Day is typically filled with announcements about how semiconductor companies are addressing environmental issues. It also signals the beginning of the Environment, Social and Governance (ESG) reporting season that typically starts in the April time...

ASE Kaohsiung Achieves 20 million Tons of Water Savings Milestone in Line with its Water Management Strategy

May 13, 2021

Kaohsiung, Taiwan. May 10, 2021. ASE understands the vulnerability of water disruption to its operations and as such, is leading efforts to fight one of the worst droughts that Taiwan has ever experienced. As part of its total water management strategy, ASE has been operating its own water recycling facility...

If a Tree Falls in the Forest, Does it Produce Carbon Dioxide?

Mar 24, 2021

While working with a committee on evaluating multiple microelectronics companies for their efforts on sustainability an interesting question arose. Is a company being sustainable if it switches to renewables, but don’t reduce their energy footprint? In an industry where the semiconductor unit growth rate runs about 10% — TSMC builds...

2024 3D InCites Awards Winner Circle

Apr 21, 2024

2024 3D InCites Awards Winner Circle The Winner’s Circle The Technology Enablement Awards Carl Zeiss Microscopy We’re incredibly honored to be selected by 3D InCites as a Technology Enablement Award recipient. ZEISS is proud to be the world’s leading manufacturer of light, electron and X-ray microscopes. We continually push boundaries...

2024 3D InCites Awards Finalists

Jan 09, 2024

Presenting the 2024 3D InCites Awards Finalists. The 2024 3D InCites Awards celebrates excellence in heterogeneous integration, 3D HI, and chiplet technologies; sustainability; diversity, equity, and inclusion (DEI); and the Best Place to Work. Companies submitted applications for each category described below. The Advanced Technology Enablement Awards recognizes efforts across the...