Matches for your search: "SEMICON West"
Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528. This year’s exhibit highlights Koh Young’s commitment to delivering production-speed and high-precision...
Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for...
MacDermid Alpha presents advanced packaging and power semiconductor materials at SEMICON Taiwan, highlighting reliability, sustainability, and expert insights at the TechXPOT forum. MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will showcase its advanced packaging solutions for next-generation semiconductor devices at the...
Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets, will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held September 10-12 in Taipei, Taiwan. Indium Corporation specializes in semiconductor...
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716 Aylesbury, Bucks, UK – 16 September 2020 — Nordson Corporation (NASDAQ: NDSN) announces that six product lines from its Nordson ELECTRONICS SOLUTIONS division will be exhibiting...
Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays a key role in the semiconductor industry. It is today already implemented as a mature solution, in several market segments such as infrared (IR) cut filter for CMOS image sensor (CIS) technology, microfluidics...
Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as a result of Fogale Group’s acquisition of Altatech, resulting in a semiconductor equipment portfolio that spans the spectrum of process control needs for advanced wafer-level and 3D packaging, including metrology,...
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the wafer is thinned to expose the Cu “nails” that ultimately form the interconnect between die stacks. Some of the risks involved in this step include backside contamination (Cu diffusion) due...
Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV Group North America. Since EV Group launched a tool last week at SEMICON Singapore, and since EVG NA’s headquarters are practically in 3D InCites’ back yard, I thought it was...
Note to self: when visiting a class 10 clean room that requires full clean room attire (bonnet, booties, coverall, hood and boots) don’t wear a skirt!
