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Global IC market expected to exceed $500 billion for the first time. The post IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24% appeared first on Semiconductor Digest.
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The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings. General 3DFabricTM Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric. 2.5D package technology – CoWoS The 2.5D packaging options are divided into the CoWoS… Read More The post Highlights of the TSMC […]
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TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions. “As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology […]
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Ultra-High-Density Fan-Out (UHD FO) Packaging has started to be commercialized in the market. This advanced packaging market segment has been deeply analyzed by Yole Développement (Yole) and the advanced packaging team with a dedicated report, Fan-Out WLP and PLP Applications and Technologies 2021. In this new technology & market report, the market research & strategy […]
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The chip shortage in the wake of COVID 19 is such a big story that it’s attracting mainstream media attention, and it feels like the general public now knows what semiconductors are. The upshot is that the shortage combined with the demand for chips is putting a strain on the entire semiconductor supply chain. With […]
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TSMC said its customers are looking for high performance computing to support autonomous driving in vehicles. That’s new. And also old. The post TSMC’s Zhang: Automotive is Going HPC appeared first on EETimes.
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Tapping into multiple services, both inside and outside a car, requires a rethinking of everything from architectures to security. The post Big Changes Ahead For Connected Vehicles appeared first on Semiconductor Engineering.
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It was bad enough when only the walls had ears. It’s going to be far worse when everything has ears.
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By Junko Yoshida for EETIMES – An accelerated U.S. vs. China trade war has elevated “decoupling” into a trendy buzzword to describe the possibility of a breakup between two of the world’s most powerful economies. The question at hand, though, is if there really is a decoupling going on? Perhaps not on the macro-economic level, […]
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Today we are talking about the importance of sustainability in semiconductor manufacturing, which you may have noticed is a really hot topic right now. And it's also one we feel really strongly about because of its impact on the future of society. Our guests today are Dean Freeman, who has been blogging about it for […]
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Industrial, consumer ad automotive are driving the adoption of neuromorphic with first products. “AI is hungry for performance, and Moore’s law dynamics will not suffice to cover the needs of the ongoing 5G/IoT/AR/Robotic revolution. The ecosystem is and will stay R&D-oriented for the next 3 to 5 years.” asserts Adrien Sanchez, Technology & Market Analyst, […]
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Long lead times expected at least through the end of this year, as chipmakers scramble for solutions. The post Automotive IC Shortage Drags On appeared first on Semiconductor Engineering.
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Welcome to our very first episode! Because podcasting is becoming an essential part of any business’s marketing toolbox, we thought it would be great to kick it off with a basic discussion about ways to market your company in this competitive industry. To do that, we tapped into Joe Cestari, Executive Director of our community […]
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While high-volume chips are expected to recover from recent shortages relatively quickly, small and medium-sized IC orders face a rocky path. The post Chiplets: A Solution For The Shortage Of Chips appeared first on Semiconductor Engineering.
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An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt. The post The Chip Shortage Wake-up Call appeared first on Semiconductor Digest.
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Is there any technology you took for granted until you discovered that others had no idea of its existence?
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Businesses have limited options to solve the current chip shortages, but they can prepare for the next crisis. The post What Chip Shortages Taught Us About Supply Chain Resiliency appeared first on EETimes.
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IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024. The […]
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Awareness grows, but so does the complexity of systems and the potential attack surface. The post IC Security Threat Grows As More Devices Are Connected appeared first on Semiconductor Engineering.
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Mobility app developer Lyft has signed an agreement with Woven Planet Holdings, a subsidiary of Toyota Motor Corporation, for the acquisition of Lyft’s self-driving vehicle division, Level 5. The transaction also includes multi-year non-exclusive commercial agreements between Lyft and Woven Planet to accelerate the development and enhance the safety of automated driving technology. “Announcement launches […]
