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Intel announces a first-of-its-kind Semiconductor Co-Investment Program that introduces a new funding model to the capital-intensive semiconductor industry. Intel Signs Agreement with Brookfield to Jointly Invest up to $30 billion in Leading-edge Chip Factories in AZ was posted by Pete Singer on Semiconductor Digest.
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Choice of packaging technology is influenced by the communication interface between chiplets. The post Heterogeneous IC Packaging: Optimizing Performance And Cost appeared first on Semiconductor Engineering.
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Manufacturability reaches sufficient level to compete with flip-chip BGA and 2.5D. The post Fan-Out Packaging Gets Competitive appeared first on Semiconductor Engineering.
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This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place. Chips aren’t the only thing in short supply, the semiconductor industry talent shortage continues, and SEMI has launched a workforce initiative to address this. In […]
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When you can’t out, you go up. 3D devices are coming and we’ll be ready. The post Can You Afford DFT For 3D Stacked Die? appeared first on Semiconductor Engineering.
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While the CHIPS Act escalates the long-standing U.S.-China tech rivalry, Intel, Samsung, SK Hynix, and TSMC are the non-Chinese companies that stand to suffer the most, a former TSMC exec writes. The post Opinion: CHIPS Act Escalates Long-Standing U.S.-China Tech Rivalry appeared first on EETimes.
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In this episode, Françoise von Trapp interviews Laura Matz, CEO of Athinia™ and Chief Science and Technology Officer of Merck KGaA, Darmstadt, Germany, about the growing need for data collaboration between materials suppliers and semiconductor device manufacturers, and the solution she helped create. Over the past 10 years, more new materials have been introduced into […]
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SemiWiki has been tracking the popularity of chiplets for two years now so it was not surprising to see that they played a key role at DAC. The other trend we foresaw was that the ASIC companies would be early chiplet adopters and that has proven true. One of the more vocal proponents of chiplets […]
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How to level the playing field with AI software engineers. Shortages of Equipment, Design Engineers, Face Booming Semiconductor Industry was posted by Pete Singer on Semiconductor Digest.
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The secondary semiconductor equipment market has been under a strain as secondary tools have been in hot demand since the chip shortage began in 2020 impacting the entire semiconductor supply chain. Here to speak with Françoise about this are Bruce Kim and Jin Choi of SurplusGLOBAL. They are their company’s perspective, and the actions they […]
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Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking. The post Hybrid Bonding Moves Into The Fast Lane appeared first on Semiconductor Engineering.
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Common themes emerge, but so do different ways of looking at a problem, from business opportunity to concern for the environment. The post Distilling The Essence Of Four DAC Keynotes appeared first on Semiconductor Engineering.
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In this episode, we visit 3D InCites member companies on the trade show floor at SEMICON West and the Design Automation Conference to learn about what they are showcasing this year. Dave Kirsch and Paul Lindner of EV Group talk about the latest achievement in die-to-wafer fusion and hybrid bonding, and what it means for […]
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This podcast episode was recorded live at SEMICON West 2022 at the Moscone Center in San Francisco, where critical discussions about the latest issues impacting the semiconductor industry took place. Françoise von Trapp speaks with Joe Stockunas, the new President of SEMI Americas; Ajit Manocha, SEMI CEO and President; Mousumi Bhat, who heads up SEMI’s […]
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Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an open chiplet ecosystem. Although the initial specification for UCIe was developed by Intel, a consortium was announced in March with Intel, AMD, Arm, Google,… Read More The post OpenFive Joins Universal […]
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SEMI today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress. SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval was posted by Shannon Davis on Semiconductor Digest.
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With over 350 FDA–approved medical devices using AI, the technology is enabling portable MRI machines, foolproof ultrasounds, and more The post When We Put AI in Medical Devices, Magic Starts to Happen appeared first on EETimes.
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Why new approaches are required to design complex multi-chip systems. The post Customization, Heterogenous Integration, And Brute Force Verification appeared first on Semiconductor Engineering.
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Françoise von Trapp interviews Thomas Smelker, of Mercury Systems, about what is meant by “Trusted and Secure” microelectronics, and why it is critical to Mercury’s military, aerospace, space, and industrial customers. He then does a deep dive into the geopolitical climate, the “actors” are trying to take away the technological advantage the US and its […]
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Choosing components from a multi-vendor menu holds huge promise for reducing costs and time-to-market, but it’s not as simple as it sounds. The post Security Risks Widen With Commercial Chiplets appeared first on Semiconductor Engineering.
