More Data, More Memory-Scaling Issues – SemiEngineering
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Challenges persist for DRAM, flash, and new memories. The post More Data, More Memory-Scaling Issues appeared first on Semiconductor Engineering.
Recommended Reads
A Modern Marvel: The Taiwan Tech Arena at CES 2021 – EE Times
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For tech lovers and engineers alike, it’s that time of year again, where the best and brightest minds in the industry gather together at the Consumer Electronics Show (CES) to show off the latest tech and gadgets. The Taiwan Tech Arena, in particular, will be showcasing many new developments in the fields of cloud services, […]
The Impact Of 5G On Silicon Design – SemiEngineering
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Bandwidth, latency, and power consumption are the primary challenges for upcoming 5G designs. The post The Impact Of 5G On Silicon Design appeared first on Semiconductor Engineering.
Episode 302: CES and GE Lighting is betting on Cync – IoT Podcast
This week Kevin and I discuss Allegion’s acquisition of Yonomi, and what that means for those of you using the cloud service or consumers using the app. We then turn to a mention of the rebranding of GE Lighting after its acquisition by Savant last summer before talking about Singapore’s about-face on the use of […]
Samsung Touts Superiority of Stand Alone Version of 5G -EE Times
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Samsung is advocating jumping past 5G NR to 5G Stand Alone (SA). The company established a transmission rate record with partner Intel. The post Samsung Touts Superiority of Stand Alone Version of 5G appeared first on EETimes.
Why It’s So Hard To Stop Cyber Attacks On ICs – SemiEngineering
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Experts at the Table: Any chip can be reverse-engineered, so what can be done to minimize the damage? The post Why It’s So Hard To Stop Cyber Attacks On ICs appeared first on Semiconductor Engineering.
A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last – SemiEngineering
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How a FOCoS chip production line that yielded over 99% was established, and higher integration complexity achieved to meet the growing needs of the 5G era. The post A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last appeared first on Semiconductor Engineering.
Episode 299: LoRaWAN tries to co-opt Amazon Sidewalk – IoT Podcast
This week’s show kicked off with us discussing a fascinating interview with the head of the LoRa Alliance about its efforts to bring Amazon’s Sidewalk network into compliance with the LoRaWan standard. We then discussed Apple’s app privacy labels, a similar option for Google users, and the nutrition-style label for connected device security. Then it […]
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM – Semiconductor Digest
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CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The post CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM appeared first on Semiconductor Digest.
Chip Scaling, China Spending Fuel Fab Capex Surge – EE Times
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The shift to finer chip geometries and China’s SMIC accounted for the sharp increase in foundry spending. The post Chip Scaling, China Spending Fuel Fab Capex Surge appeared first on EETimes.
STMicroelectronics to be Carbon Neutral by 2027 – Semiconductor Digest
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STMicroelectronics announced its goal to become carbon neutral by 2027, the earliest date anticipated for any semiconductor company globally. The post STMicroelectronics to be Carbon Neutral by 2027 appeared first on Semiconductor Digest.
DARPA Looks to Light Up Integrated Photonics with Chip-scale Laser Development – iMicronews
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Agency announces performer teams selected for LUMOS program First demonstrated sixty years ago, the laser has become an essential technology in world. It has transformed diverse fields including communications, sensing, manufacturing, and medicine. More recently, innovations in integrated photonics have allowed the miniaturization of key optical components and the ability to arrange several elements on […]
How Will Future Cars Interact With Humans? – SemiEngineering
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Adapting technology to the driver can have very different results than training the driver to use technology. The post How Will Future Cars Interact With Humans? appeared first on Semiconductor Engineering.
The Detritus of a Digital Life – EE Times
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My contacts are just part of the digital baggage I lug from one phone to the next. My photos are a bit out of control… The post The Detritus of a Digital Life appeared first on EETimes.
Is Apple the Most Valuable Semiconductor Company in the World? – SemiWiki
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– The new M1 chip unveils previously hidden asset – Could/should Apple sell semiconductors? – Are servers next? – The M1 chip appears to be a rousing success and the beginning of a new era Essentially 100% of all early reports on the performance of the M1 chip have come back with stellar reviews. Great […]
Episode 295: Project CHIP Goes Commercial and the Eero Pro Review – IoT Podcast
This week’s podcast kicks off with the news that Project Connected Home over IP (CHIP) will also have a commercial element focused on offices, apartments, and public buildings. Then we focus on edge computing with a new way to bring machine learning to the edge and Arm expanding its free IP license program to some […]
The Ten Commandments Of Packaging – SemiEngineering
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Reducing handling, predicting failures, and more tips for dealing with complex packaging technologies. The post The Ten Commandments Of Packaging appeared first on Semiconductor Engineering.
Apple M1 Processor, Passing on the Chiplets – EE Times
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In light of Apple’s M1 processor announcement this week, let me ponder why Apple passed on the chiplets, and where chiplets make sense. The post Apple M1 Processor, Passing on the Chiplets appeared first on EETimes.
TSMC to Build first US Fab in Arizona – SemiWiki
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Well, it’s official, the TSMC Board of Directors approved an investment to establish a wholly-owned subsidiary in Arizona with a paid-in capital of $3.5 billion. As history shows the investment may be more than that but $3.5B is a great starting point. This is being discussed in the SemiWiki Forum and I have been gathering […]
Qualcomm Allowed to Sell 4G Chips to Huawei in Exception to Ban – iMicronews
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Qualcomm received a license from the U.S. government to sell 4G mobile phone chips to China’s Huawei Technologies, an exemption to U.S. trade restrictions imposed amid rising tensions with China. “We received a license for a number of products, which includes some 4G products,” a Qualcomm spokeswoman told Reuters. Qualcomm and all other American semiconductor […]
