|
In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward. Beth and Erica provide details on three major initiatives: One is to create awareness in the US […]
|
In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022. In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that […]
|
The SEMI Foundation partners with Foothill College, Ignited Education, and Krause Center for Innovation to develop microelectronics career training program. SEMI Wins $1 Million Grant to Create Community College Apprenticeship Program for Microelectronics Industry Workforce Development was posted by Shannon Davis on Semiconductor Digest.
|
Maricopa County, Arizona, program aims to teach American workers new skills and make artificial intelligence more accessible. Intel, Community College District in Arizona Launch First-of-its-Kind AI Lab was posted by Shannon Davis on Semiconductor Digest.
|
The SiC market is anticipating incredible growth, with a new wave of capacity expansion and supply chain integration. The market research and strategy consulting company Yole Développement (Yole) has developed a core compound semiconductor expertise with a dedicated team of technology and market experts for more than 20 years. Throughout the year, Yole’s analysts deliver […]
|
The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate […]
|
The US is intent on reshoring electronics, but it’s ignoring entire industry segments. The risk will be frittering away $52 billion. The post US Electronics Reshoring Plan Risks Missing the Boat appeared first on EETimes.
|
TSMC has been building the largest and strongest patent portfolio, followed by Samsung, and Intel. Patent quality is a concern for some semiconductor companies, however. The post Patent Trends Foretell Chipmakers’ Fortunes appeared first on EETimes.
|
Engineering and materials science company Advanced Furnace Technology Ltd of Cambridge, UK (which provides specialist graphite services such as graphite cleaning, purification and coating) says that its director of research Dr Zoe Tolkien has won £50,000 and a mentoring and support package after being named a winner at the ‘Women in Innovation’ awards of the […]
|
Last November, Intel held their Innovation Days, with opening keynote by CEO Pat Gelsinger. Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1 was posted by Shannon Davis on Semiconductor Digest.
|
Having made the transition to FinFET, new generations followed, and we now have the Intel 7 Alder Lake part, released towards the end of last year. Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2 was posted by Shannon Davis on Semiconductor Digest.
|
We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them […]
|
By Chris Jones, Edwards Vacuum This post will look at highlights of a similar report written by the International Energy Agency (IEA), which examines the issues through a more global lens. Net-Zero by 2050 – A Roadmap for the Global Energy Sector was posted by Shannon Davis on Semiconductor Digest.
|
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotech, and semiconductor markets, and Teramount, a developer of scalable solutions for connecting optical fibers to silicon chips, have announced, at this week’s OFC expo, a collaboration on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber […]
|
Several Yole Développement (Yole) reports, such as Fan-Out WLP and PLP Applications and Technologies 2021, highlight the expected growth in the Fan-out (FO) packaging market. A CAGR2020-2026 of 15% is expected and will drive the market to a value of $2.5B in 2026. This rapid growth is propelled by consumer and mobile applications, while automotive […]
|
IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two […]
|
5G-hyperscale convergence holds a lot of promise for businesses, cities, and consumers. But engineers must collaborate to deliver on that promise. The post Hyperscalers and 5G: Collision or Collusion? appeared first on EETimes.
|
Ensuring the intended connectivity of the die, silicon interposer, and organic substrate. The post Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design appeared first on Semiconductor Engineering.
|
Yole Développement (Yole) has recently published two technology & market reports, Imaging for Automotive (2022 edition coming soon)and Computing and AI Technologies for Mobile and Consumer Applications and one Processor Quarterly Market Monitor. These highlighted some interesting views relevant to the acquisition of Tower semiconductor by Intel Corp. Intel has subscribed to the “More Moore” […]
|
One of our most listened-to episodes in Season 1 was on the importance of package design for chiplet integration. For those of you who are new to this podcast and chiplet technology, in a nutshell: Chiplets are hardened blocks of IP of different semiconductor technology nodes that result from disaggregating – literally taking apart a […]
