We’re really excited about radar in this week’s episode, so we discuss Ring’s new doorbell that added it for motion detection and Apple’s patent that plans to use radar for detecting vital signs. We also talk about radar being a feature that Plume plans to add to its Wi-Fi devices in the near future while […]
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Innovative business models emerge, but so does possibility of consolidation. The post Shortages, Challenges Engulf Packaging Supply Chain appeared first on Semiconductor Engineering.
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Packaging and verifying the integrity of advanced and connected semiconductor devices is proving challenging when it comes to gaining user trust in new applications. This topic has become even more critical as circuit design, semiconductor manufacturing, chip design tools, and IP involves collaborating with different teams and/or parties across the globe. ASIC packaging design is […]
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The SIA and leading chip company CEOs ask US President for support The post CEOs Urge President Biden to Fund Chips, Executive Order Expected appeared first on EETimes.
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How model-based systems engineering can help minimize the growing amount of energy consumed by IoT devices. The post Design Support For A Green IoT appeared first on Semiconductor Engineering.
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TSMC said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon. The post TSMC to Raise $9 Billion for Expansion Amid Shortages appeared first on EETimes.
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The failure of auto companies to secure supplies of chips reflects widespread shortages in the semiconductor industry. The post Auto Industry Chip Shortages Reflect Wider Shortfall appeared first on EETimes.
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Communication, security, and power issues still need to be solved, but there is progress. The post Bridging The Gap Between Smart Cities And Autonomous Vehicles appeared first on Semiconductor Engineering.
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New markets, different architectures, and continued virtual work environments all point to positive and sustained growth. The post Roaring ’20s For The Chip Industry appeared first on Semiconductor Engineering.
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-Intel good results had a little extra help to be great -New CEO commits to remaining an IDM versus fabless -Claims of strong progress on 7NM fuel optimism inside -Outsourcing to TSMC will not go away but will increase A good quarter but with some silicon enhancements from ICAP Intel reported Revenues of $20B and […]
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The latest gadgets were unveiled at CES 2021 including robots, drones, health monitors, holographs, and smart perfume. The post The Latest Gadgets Unveiled at CES 2021 appeared first on EETimes.
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Before we were all blindsided by Covid-19, 5G, edge computing, and Wi-Fi 6 were being rolled out. How did the pandemic affect all that? The post 5G and the Covid-19 Effect appeared first on EETimes.
This week’s show kicks off with Kevin and I discussing a smart camera vulnerability before digging into what it means when the White House becomes a smart home. We then discuss Wi-Fi 6E and what it means for IoT. Next up: new devices from Signify which makes Philips Hue-branded gear. Then we dig into Google […]
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The power electronics industry is transitioning from silicon to wide bandgap compound semiconductor materials such as silicon carbide and gallium nitride. The post Mobility And 5G Drive Adoption Of New Materials For Power Devices appeared first on Semiconductor Engineering.
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We just witnessed Intel reportedly having forced Bob Swan to install Pat Gelsinger, its prodigal son, while Qualcomm handed over the baton to president Cristiano Amon. The post Traps Intel’s Prodigal Son Should Avoid appeared first on EETimes.
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Despite short-term struggles, escalating US restrictions will bolster China’s domestic semiconductor industry in the long-term. At Yole Développement (Yole) we follow this industry and deliver our vision all year long through an impressive collection of technology & market reports as well as monitors: Status of the Advanced Packaging Industry, Status of the Power Electronics Industry, […]
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Advanced nodes and packaging are turning minor issues into major ones. The post Die-To-Die Stress Becomes A Major Issue appeared first on Semiconductor Engineering.
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Challenges persist for DRAM, flash, and new memories. The post More Data, More Memory-Scaling Issues appeared first on Semiconductor Engineering.
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For tech lovers and engineers alike, it’s that time of year again, where the best and brightest minds in the industry gather together at the Consumer Electronics Show (CES) to show off the latest tech and gadgets. The Taiwan Tech Arena, in particular, will be showcasing many new developments in the fields of cloud services, […]
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Bandwidth, latency, and power consumption are the primary challenges for upcoming 5G designs. The post The Impact Of 5G On Silicon Design appeared first on Semiconductor Engineering.
