Recommended Reads

Amkor Empowers RF Front-end Cellular Innovations with Advanced SiP – iMicronews

Aug 12, 2021 | I-Micronews

Highlights • Amkor is advancing the evolution of 5G RF module design • Amkor DSMBGA enables integration of more components • The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 • Amkor continues to innovate in advanced SiP technologies Amkor Technology, Inc. (Nasdaq: AMKR), a leading […]

Member Spotlight: A Conversation About Working on the Mars Rover Perseverance

Jul 29, 2021 | 3D InCites Podcast

Earlier this year, on February 18, 2021, the next-generation Mars Rover, Perseverance, successfully landed on Mars. According to Earth and Sky Magazine, Perseverance was the first artificial object to land on Mars since 2018, and the first Rover to land since 2012 when Curiosity touched down.  Perseverance traveled 293 million miles (472 million km) – […]

While Industry Booms, China Worries Mount – Semiconductor Digest

Jul 28, 2021 | Semiconductor Digest

While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff. While Industry Booms, China […]

Highlights of the 71st ECTC Conference – iMicronews

Jul 26, 2021 | I-Micronews

The 71st IEEE Electronic Components and Technology Conference (ECTC) started on June 1 and remained open until July 16, 2021 due to popular demand. The conference was held virtually, and attracted 1,380 attendees from 23 countries. The 71st ECTC included 346 papers in 46 technical sessions and a record 14 special sessions and panels, delivering […]

System-in-Package industry: IDMs, OSATs, and Foundries are taking the Advantage – iMicronews

Jul 22, 2021 | I-Micronews

Through enabling design and supply chain agility, SiP will reach more than $19B by 2026. “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the […]

Advanced Packaging Technologies Overcoming the Memory System Performance and Capacity Limitation – EE Times

Jul 21, 2021 | EE Times

In the relentless pursuit to increase performance while reducing size, the semiconductor industry is exploring every avenue possible. Packaging, the process of combining different parts of a component, provides a promising area for advancements. An expert from SK hynix offers insights on how new packaging technologies, such as TSV (through-silicon via), are helping create smaller, […]

A brave new MEMS world: a $18.2B market by 2026 – iMicronews

Jul 15, 2021 | I-Micronews

The MEMS market will grow due to new opportunities in audio for microphones, microspeakers and inertial MEMS, AR/VR for optical MEMS, and other emerging applications. “Last year when COVID-19 erupted, the effects on various industries were felt immediately, which in turn had an after-effect on the MEMS business. But the crisis did not impact all […]

Will Electrification Mean the End of the Road for Automotive MEMS Pressure Sensors? – iMicronews

Jul 01, 2021 | I-Micronews

The dominance of MEMS pressure sensors in the automotive market may be under threat as the industry moves to replace Internal Combustion Engine (ICE) vehicles with EVs. Electrification will reduce many ‘traditional’ application areas in hybrid models and eliminate them altogether in fully electric vehicles. The market research and strategy consulting company, Yole Développement (Yole) […]

Member Spotlight: A Conversation about Novel Nano-Coating Technology and Collaboration

Jul 01, 2021 | 3D InCites Podcast

In this first Member Spotlight episode,  we have a conversation with  Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What’s exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer […]

Supply Chain Resiliency – SemiEngeering

Jun 30, 2021 | SemiEngineering

The potential risks of an unsecured supply chain and how to achieve supply chain security through tools, testing, and/or professional services. The post Supply Chain Resiliency appeared first on Semiconductor Engineering.

Business Collaboration to Launch an EV Battery Swapping Service – iMicronews

Jun 22, 2021 | I-Micronews

ENEOS Holdings, (CEO: Katsuyuki Ota, hereinafter referred to as “ENEOS”) and Ample, (CEO: Khaled Hassounah, President: John de Souza, hereinafter referred to as “Ample”), a U.S-based startup that ENEOS invested in, are announcing a business collaboration to launch an EV battery swapping service in Japan. Through this partnership, both companies aim to develop an energy […]

5 Key Vulnerabilities in the Semiconductor Supply Chain – Semiconductor Digest

Jun 22, 2021 | Semiconductor Digest

There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve. The post 5 Key Vulnerabilities in the Semiconductor Supply Chain appeared first on Semiconductor Digest.

A Conversation with Bharat Kapoor about Creating a Resilient Semiconductor Supply Chain

Jun 22, 2021 | 3D InCites Podcast

In this episode, Françoise interviews Bharat Kapoor, lead partner, Americas, at Kearney. a global strategy and management consulting firm, where he founded and leads PERLab, the firm’s design innovation service. Bharat has solid roots in semiconductor engineering and design. His interest in electrical engineering began in his hometown in the Himalayas when he was in […]