Recommended Reads

Is UCIe Really Universal? – SemiEngineering

Nov 23, 2022 | SemiEngineering

Why developing a multi-vendor standard for plug-and-play chiplets is so difficult. The post Is UCIe Really Universal? appeared first on Semiconductor Engineering.

Plasma-Therm’s Grenoble Site Made EMEA HQ – Semiconductor Today

Nov 18, 2022 | Semiconductor Today

Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process equipment for the semiconductor and compound semiconductor markets) says that its site in Grenoble, France will serve as regional headquarters to support customers in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced […]

Wall Street View Of EDA Industry – SemiEngineering

Nov 18, 2022 | SemiEngineering

The impact of hardware-assisted verification and the growth of semiconductor R&D spending on EDA fortunes. The post Wall Street View Of EDA Industry appeared first on Semiconductor Engineering.

EDA 2.0: Catalyzing the Human – EE Times

Nov 10, 2022 | EE Times

Chips are getting more complex; that’s a given. Whether it’s for enabling more computing performance in less space or embedding more intelligence into sensors and endpoint devices, designs are becoming more sophisticated; require more design expertise to optimize for power, performance, and area (PPA); and take longer for the whole design cycle, which includes verification […]

A Conversation with Beth Keser About Writing A Book on Advanced Fanout Wafer Level Packaging

Nov 10, 2022 | 3D InCites Podcast

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging […]

The IMAPS DEI Panel Discusses the Difference between Equality and Equity

Oct 27, 2022 | 3D InCites Podcast

For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca. Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions […]

Member Spotlight: Conversations from 2022 MAPS International Symposium

Oct 20, 2022 | 3D InCites Podcast

25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. Craig North, of Gel-Pak, is on a mission to find out as much […]

Keynote Conversations from the 2022 IMAPS International Symposium

Oct 13, 2022 | 3D InCites Podcast

in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices). We’re back on the road – recording a series of episodes at the IMAPS International Symposium. […]