Amkor Empowers RF Front-end Cellular Innovations with Advanced SiP – iMicronews
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Highlights • Amkor is advancing the evolution of 5G RF module design • Amkor DSMBGA enables integration of more components • The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 • Amkor continues to innovate in advanced SiP technologies Amkor Technology, Inc. (Nasdaq: AMKR), a leading […]