|
This week, we’re wrapping up our conversations from the IMAPS InternatinSymposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now? You’ll hear from Jan […]
|
Demand for IC design services grows, but uptake in other chip sectors may have peaked. The post Semiconductor Sector Shows Signs of Cooling appeared first on EETimes.
|
Vendors and market watchers are already promoting 6G. What will the wireless technology actually do if and when it arrives in 2030? The post 6G: More Hype Than Reality? appeared first on EETimes.
|
Apple joins as first public partner in new imec research program that helps entire semiconductor value chain reduce its ecological footprint. Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announces that Apple Inc. has joined imec’s brand-new Sustainable Semiconductor Technologies and Systems (SSTS) research program. The SSTS program is the […]
|
If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also […]
|
Imec’s SVP drills down into GAA FETs, interconnects, chiplets, and 3D packaging. The post What’s Next For Transistors And Chiplets appeared first on Semiconductor Engineering.
|
Putting several functions into a single SiP without interference. The post The New Technology Solutions For Advanced SiP Devices appeared first on Semiconductor Engineering.
|
We’re changing things up a bit for the next few weeks with a series of podcast episodes recorded live at the IMAPS International Symposium in San Diego. How we’ve missed those live events and the hallway conversations! We figured you did too, so we convinced some of our colleagues to sit down with Françoise and […]
|
New options open the door to much faster and more reliable systems. The post Will Co-Packaged Optics Replace Pluggables? appeared first on Semiconductor Engineering.
|
Taiwan Semiconductor Manufacturing the world’s biggest contract chipmaker, announced it will build its first-ever chip plant in Japan, answering Tokyo’s call to strengthen the local semiconductor supply chain to cope with an unprecedented global crunch in key components. TSMC CEO C.C. Wei told investors that the company has received support from both its customers and […]
|
Combined, China and Taiwan would hold about 37% of global IC capacity, almost 3x that of North America. IC Industry at Heart of Possible China Takeover of Taiwan was posted by Shannon Davis on Semiconductor Digest.
|
Even Google had trouble keeping up with the twisty turns and stealth signage that require split-second decisions in downtown Boston. The post Tech Goes on Vacation appeared first on EETimes.
|
AI features are becoming standard in consumer applications. Yole announces a US$ 5.6 billion market by 2026. “AI technologies are already in many products that we use every day.” asserts Adrien Sanchez, Technology & Market Analyst, Computing & Software at Yole Développement (Yole). He adds: “They started in our smartphones, through applications such as face […]
|
Even older vehicles can run on batteries, but there are limitations. The post Don’t Toss That Gasoline Engine Just Yet appeared first on Semiconductor Engineering.
|
Globally, sustainability has become a much larger conversation than just taking steps to achieve zero carbon emissions. The UN has established 17 sustainable development goals that cover everything from climate change to diversity, equity, and inclusion. As the world becomes more socially conscious, it is no longer enough for a company to be profitable – […]
|
Like cities, chips need to go vertical to expand. The post 3D IC: Opportunities, Challenges, And Solutions appeared first on Semiconductor Engineering.
|
Chiplet integration can enable disaggregated server, heterogenous computing and domain-specific acceleration within data centers. The post Chiplet Strategy is Key to Addressing Compute Density Challenges appeared first on EETimes.
|
How to determine appropriate electrostatic discharge robustness requirements. The post Can We Efficiently Automate 2.5/3D IC ESD Protection Verification? appeared first on Semiconductor Engineering.
|
Advanced packaging is now of strategic importance for IDMs, foundries, and OSATs, leading to more than US$10 billion in investment. “The advanced packaging market was worth US$30 billion in 2020 and is expected to grow at a CAGR of 8% to reach US$47.5 billion in 2026 during this period”, asserts Santosh Kumar Principal Analyst & […]
|
Chiplets are the new “It” heterogeneous integration technology. Many believe they provide the solution to power, performance, area and cost (PPAC) for everything from mobile computing and automotive applications, to 5G, high-performance computing, and artificial intelligence. In this podcast episode, Françoise speaks with 3D InCites’ Community Members, Kevin Rinebold of Siemens EDA, and Robin Davis […]
